METHODS AND SYSTEMS FOR UTILIZING DESIGN DATA IN COMBINATION WITH INSPECTION DATA
Granted: November 24, 2011
Application Number:
20110286656
Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the…
ILLUMINATION SUBSYSTEMS OF A METROLOGY SYSTEM, METROLOGY SYSTEMS, AND METHODS FOR ILLUMINATING A SPECIMEN FOR METROLOGY MEASUREMENTS
Granted: November 17, 2011
Application Number:
20110279819
Illumination subsystems of a metrology system, metrology systems, and methods for illuminating a specimen for metrology measurements are provided.
SYSTEMS AND METHODS FOR DETECTING DESIGN AND PROCESS DEFECTS ON A WAFER, REVIEWING DEFECTS ON A WAFER, SELECTING ONE OR MORE FEATURES WITHIN A DESIGN FOR USE AS PROCESS MONITORING FEATURES, OR SOME COMBINATION THEREOF
Granted: November 10, 2011
Application Number:
20110276935
Various systems and methods for detecting design and process defects on a wafer, reviewing defects on a wafer, selecting one or more features within a design for use as process monitoring features, or some combination thereof are provided.
APPARATUS AND METHODS FOR SETTING UP OPTICAL INSPECTION PARAMETERS
Granted: October 20, 2011
Application Number:
20110255081
Provided are novel methods and systems for setting up ranges of optical inspection parameters. These ranges may be later used for inspection of photovoltaic cells for discoloration, for example. A set of values corresponding to an inspection parameter, such as hue, saturation, and intensity, is obtained from a set-up image. The image includes multiple set-up areas, e.g., a defined group of pixels, wherein each set-up area is assigned a corresponding value in the set. A test image is then…
METHODS OF AND APPARATUSES FOR MAINTENANCE, DIAGNOSIS, AND OPTIMIZATION OF PROCESSES
Granted: October 6, 2011
Application Number:
20110240610
A sensor apparatus for measuring a plasma process parameter for processing a workpiece. The sensor apparatus includes a base, an information processor supported on or in the base, and at least one sensor supported on or in the base. The at least one sensor includes at least one sensing element configured for measuring an electrical property of a plasma and may include a transducer coupled to the at least one sensing element. The transducer can be configured to receive a signal from the…
OPTICAL IMAGING SYSTEM WITH CATOPTRIC OBJECTIVE; BROADBAND OBJECTIVE WITH MIRROR; AND REFRACTIVE LENSES AND BROADBAND OPTICAL IMAGING SYSTEM HAVING TWO OR MORE IMAGING PATHS
Granted: October 6, 2011
Application Number:
20110242528
An optical system may include an objective having at least four mirrors including an outermost mirror with aspect ratio <20:1 and focusing optics including a refractive optical element. The objective provides imaging at numerical aperture >0.7, central obscuration <35% in pupil. An objective may have two or more mirrors, one with a refractive module that seals off an outermost mirror's central opening. A broad band imaging system may include one objective and two or more imaging…
ILLUMINATING A SPECIMEN FOR METROLOGY OR INSPECTION
Granted: September 22, 2011
Application Number:
20110228263
Illumination subsystems of a metrology or inspection system, metrology systems, inspection systems, and methods for illuminating a specimen for metrology measurements or for inspection are provided.
MONITORING OF TIME-VARYING DEFECT CLASSIFICATION PERFORMANCE
Granted: September 15, 2011
Application Number:
20110224932
Systems and methods for monitoring time-varying classification performance are disclosed. A method may include, but is not limited to: receiving one or more signals indicative of one or more properties of one or more samples from one or more scanning inspection tools; determining populations of one or more defect types for the one or more samples according an application of one or more classification rules to the one or more signals received from the one or more scanning inspection…
Method for the Reproducible Determination of the Position of Structures on a Mask with a Pellicle Frame
Granted: September 15, 2011
Application Number:
20110225554
A method for the reproducible determination of the positions of structures (3) on a mask (2) is disclosed. A pellicle frame (30) is firmly attached to the mask (2). A theoretical model of the bending of the mask (2) with the firmly attached pellicle frame (30) is calculated, wherein material properties of the mask (2), of the pellicle frame (30), and of the attaching means between the pellicle frame (30) and the mask (2) are taken into account in the calculation of the bending of the…
SYSTEMS AND METHODS FOR WAFER EDGE FEATURE DETECTION AND QUANTIFICATION
Granted: September 8, 2011
Application Number:
20110218762
Disclosed herein is a method to enhance detection and quantification of features in the wafer edge/wafer roll off regions. Modifications and improvements have been made to earlier methods which enable improved accuracy and increased scope of feature detection.
Cell For Light Source
Granted: August 25, 2011
Application Number:
20110205529
A cell for a vacuum ultraviolet plasma light source, the cell having a closed sapphire tube containing at least one noble gas. Such a cell does not have a metal housing, metal-to-metal seals, or any other metal flanges or components, except for the electrodes (in some embodiments). In this manner, the cell is kept to a relatively small size, and exhibits a more uniform heating of the gas and cell than can be readily achieved with a hybridized metal/window cell design. These designs…
HIGH RESOLUTION MONITORING OF CD VARIATIONS
Granted: August 25, 2011
Application Number:
20110205554
An optical metrology method is disclosed for evaluating the uniformity of characteristics within a semiconductor region having repeating features such a memory die. The method includes obtaining measurements with a probe laser beam having a spot size on the order of micron. These measurements are compared to calibration information obtained from calibration measurements. The calibration information is derived by measuring calibration samples with the probe laser beam and at least one…
Method for focusing an object plane and optical assembly
Granted: August 25, 2011
Application Number:
20110205553
A method for focusing an object plane (42) through an objective (30) and an optical assembly (10), with which the method can be carried out, are disclosed. A geometric reference structure (21) is positioned in a plane (36) conjugate to a field plane (34) of the objective (30) and is imaged onto the object plane (42). The geometric reference structure (21) is illuminated with a light beam (24), which encloses a non-zero angle (?) with a normal direction (38) of the conjugate plane (36).…
METHOD AND SYSTEM FOR PROVIDING PROCESS TOOL CORRECTABLES USING AN OPTIMIZED SAMPLING SCHEME WITH SMART INTERPOLATION
Granted: August 18, 2011
Application Number:
20110202298
The present invention may include performing a first measurement on a wafer of a first lot of wafers via an omniscient sampling process, calculating a first set of process tool correctables utilizing one or more results of the measurement performed via an omniscient sampling process, randomly selecting a set of field sampling locations of the wafer of a first lot of wafers, calculating a second set of process tool correctables by applying an interpolation process to the randomly selected…
COMPUTER-IMPLEMENTED METHODS, COMPUTER-READABLE MEDIA, AND SYSTEMS FOR DETERMINING ONE OR MORE CHARACTERISTICS OF A WAFER
Granted: August 11, 2011
Application Number:
20110196639
Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer are provided.
COMPUTER-IMPLEMENTED METHODS, COMPUTER-READABLE MEDIA, AND SYSTEMS FOR CLASSIFYING DEFECTS DETECTED IN A MEMORY DEVICE AREA ON A WAFER
Granted: August 4, 2011
Application Number:
20110187848
Computer-implemented methods, computer-readable media, and systems for classifying defects detected in a memory device area on a wafer are provided.
Systems Configured to Generate Output Corresponding to Defects on a Specimen
Granted: July 28, 2011
Application Number:
20110181891
Systems configured to generate output corresponding to defects on a specimen and systems configured to generate phase information about defects on a specimen are provided. One system includes an optical subsystem that is configured to create interference between a test beam and a reference beam. The test beam and the reference beam are reflected from the specimen. The system also includes a detector that is configured to generate output representative of the interference between the test…
PROCESS CONDITION SENSING DEVICE AND METHOD FOR PLASMA CHAMBER
Granted: July 21, 2011
Application Number:
20110174777
A sensing device for measuring a plasma process parameter in a plasma chamber for processing workpieces may include a substrate with one or more sensor embedded in the substrate. The substrate can have a surface made of substantially the same material as workpieces that are plasma processed in the plasma chamber. Each sensor can include a collector portion made of substantially the same material as the substrate surface. The collector portion includes a surface that is level with the…
LINER FOR ENCLOSING A BODY PART DURING AN IMAGING PROCEDURE
Granted: July 14, 2011
Application Number:
20110168185
Liner (100a; 100b; 200a; 200b; 300; 400) to at least partially enclose a body part (205a; 205b; 305) during an imaging procedure, and use of a liner (100a; 100b; 200a; 200b; 300; 400) in a device that simulates the weight acting on the body part (205a; 205b; 305) essentially parallel to the longitudinal axis of the body part (205a; 205b; 305), and the use of a liner (100a; 100b; 200a; 200b; 300; 400) to create a virtual 3D model of the body part (205a; 205b; 305). The liner (100a; 100b;…
INSPECTION GUIDED OVERLAY METROLOGY
Granted: July 14, 2011
Application Number:
20110170091
Inspection guided overlay metrology may include performing a pattern search in order to identify a predetermined pattern on a semiconductor wafer, generating a care area for all instances of the predetermined pattern on the semiconductor wafer, identifying defects within generated care areas by performing an inspection scan of each of the generated care areas, wherein the inspection scan includes a low-threshold or a high sensitivity inspection scan, identifying overlay sites of the…
