Method and system for optical three dimensional topography measurement
Granted: April 28, 2020
Patent Number:
10634487
For three-dimensional topography measurement of a surface of an object patterned illumination is projected on the surface through an objective. A relative movement between the object and the objective is carried out, and plural images of the surface are recorded through the objective by a detector. The direction of the relative movement includes an oblique angle with an optical axis of the objective. Height information for a given position on the surface is derived from a variation of…
Overlay measurement using phase and amplitude modeling
Granted: April 14, 2020
Patent Number:
10622238
Methods and systems are disclosed for determining overlay in a semiconductor manufacturing process. Radiation reflected from a diffraction pattern in a metrology target may include +1 and ?1 diffraction patterns at different wavelengths and focal positions. The different wavelengths of radiation may be in a waveband where the sensitivity of contrast to wavelength is at a maximum. The reflected radiation may be analysed to obtain measured values of overlay as well as amplitude and/or…
Aided image reconstruction
Granted: April 14, 2020
Patent Number:
10621718
Methods and systems for determining boundaries of patterned features formed on a specimen from an unresolved image of the specimen are provided. One system includes computer subsystem(s) configured for comparing a difference image in which patterned feature(s) are unresolved to different simulated images. The different simulated images are generated by simulating difference images generated for the patterned feature(s) formed on the specimen with different perturbations, respectively.…
Identifying a source of nuisance defects on a wafer
Granted: April 14, 2020
Patent Number:
10620135
Methods and systems for identifying a source of nuisance defects on a wafer are provided. One method includes detecting defects on a wafer by applying a hot threshold to output generated for the wafer by a detector of an inspection subsystem such that at least a majority of the detected defects include nuisance defects and determining locations of the detected defects with respect to design information for the wafer. In addition, the method includes stacking information for the detected…
Creating defect samples for array regions
Granted: April 14, 2020
Patent Number:
10620134
Methods and systems for creating a sample of defects for a specimen are provided. One method includes detecting defects on a specimen based on output generated by a detector of an output acquisition subsystem. For the defects detected in an array region on the specimen, where the array region includes multiple array cell types, the method includes stacking information for the defects based on the multiple array cell types. The stacking includes overlaying design information for only a…
System and method for imaging a sample with an illumination source modified by a spatial selective wavelength filter
Granted: April 7, 2020
Patent Number:
10616987
A system for illuminating a sample with a spectrally filtered illumination source includes an illumination source configured to generate a beam of illumination having a first set of wavelengths. In addition, the system includes a wavelength filtering sub-system, a sample stage, an illumination sub-system, a detector, and an objective to focus illumination from the surface of one or more samples and focus the collected illumination to the detector. Further, the wavelength filtering…
Phase filter for enhanced defect detection in multilayer structure
Granted: April 7, 2020
Patent Number:
10615067
Disclosed are methods and apparatus for facilitating defect detection in a multilayer stack. The method includes selection of a set of structure parameters for modeling a particular multilayer stack and a particular defect contained within such particular multilayer stack and a set of operating parameters for an optical inspection system. Based on the set of structure and operating parameters, an electromagnetic simulation is performed of waves scattered from the particular multilayer…
Measurement of multiple patterning parameters
Granted: April 7, 2020
Patent Number:
10612916
Methods and systems for evaluating the performance of multiple patterning processes are presented. Patterned structures are measured and one or more parameter values characterizing geometric errors induced by the multiple patterning process are determined. In some examples, a single patterned target and a multiple patterned target are measured, the collected data fit to a combined measurement model, and the value of a structural parameter indicative of a geometric error induced by the…
Unified neural network for defect detection and classification
Granted: March 31, 2020
Patent Number:
10607119
Methods and systems for detecting and classifying defects on a specimen are provided. One system includes one or more components executed by one or more computer subsystems. The one or more components include a neural network configured for detecting defects on a specimen and classifying the defects detected on the specimen. The neural network includes a first portion configured for determining features of images of the specimen generated by an imaging subsystem. The neural network also…
Silicon electron emitter designs
Granted: March 31, 2020
Patent Number:
10607806
Electron source designs are disclosed. The emitter structure, which may be silicon, has a layer on it. The layer may be graphene or a photoemissive material, such as an alkali halide. An additional layer between the emitter structure and the layer or a protective layer on the layer can be included. Methods of operation and methods of manufacturing also are disclosed.
Systems and methods for detecting defects on a wafer
Granted: March 31, 2020
Patent Number:
10605744
Systems and methods for detecting defects on a wafer are provided. One method includes generating output for a wafer by scanning the wafer with an inspection system using first and second optical states of the inspection system. The first and second optical states are defined by different values for at least one optical parameter of the inspection system. The method also includes generating first image data for the wafer using the output generated using the first optical state and second…
Metrology system calibration refinement
Granted: March 31, 2020
Patent Number:
10605722
Methods and systems for matching measurement spectra across one or more optical metrology systems are presented. The values of one or more system parameters used to determine the spectral response of a specimen to a measurement performed by a target metrology system are optimized. The system parameter values are optimized such that differences between measurement spectra generated by a reference system and the target system are minimized for measurements of the same metrology targets.…
Nuisance reduction using location-based attributes
Granted: March 24, 2020
Patent Number:
10600177
Methods and systems are disclosed that provide nuisance reduction in images, such as semiconductor images that include one or more metal lines. A potential defect is correlated against pixel grey level intensity charts for two perpendicular axes. A position of the potential defect relative to a pattern, such as a metal line, is determined along the two axes. The potential defect can be classified as a defect of interest or nuisance event.
Dynamic care areas for defect detection
Granted: March 24, 2020
Patent Number:
10600175
Systems and methods of a two-pass inspection methodology that dynamically creates micro care areas for inspection of repeater defects. Micro care areas can be formed around each location of a repeater defect. After inspection, additional repeater defects in the micro care areas can be identified. Attributes of the repeater defects can be compared and any repeater defects with attributes that deviate from an expected group attribute distribution can be classified as nuisance.
Training a neural network for defect detection in low resolution images
Granted: March 24, 2020
Patent Number:
10599951
Methods and systems for training a neural network for defect detection in low resolution images are provided. One system includes an inspection tool that includes high and low resolution imaging subsystems and one or more components that include a high resolution neural network and a low resolution neural network. Computer subsystem(s) of the system are configured for generating a training set of defect images. At least one of the defect images is generated synthetically by the high…
Visual feedback for inspection algorithms and filters
Granted: March 24, 2020
Patent Number:
10599944
The disclosure is directed to providing visual feedback for inspection algorithms and difference filters used to process test and reference images from an inspection system. A user interface may be configured for displaying information and accepting user commands. A computing system communicatively coupled to the user interface may be configured to receive at least one set of test and reference images collected by the inspection system. The computing system may be further configured to…
Metrology guided inspection sample shaping of optical inspection results
Granted: March 24, 2020
Patent Number:
10598617
Information from metrology tools can be used during inspection or review with a scanning electron microscope. Metrology measurements of a wafer are interpolated and/or extrapolated over a field, which creates modified metrology data. The modified metrology data is associated with defect attributes from inspection measurements of a wafer. A wafer review sampling plan is generated based on the defect attributes and the modified metrology data. The wafer review sampling plan can be used…
Dynamic determination of metal film thickness from sheet resistance and TCR value
Granted: March 24, 2020
Patent Number:
10598477
Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the…
Symmetric target design in scatterometry overlay metrology
Granted: March 17, 2020
Patent Number:
10591406
Metrology methods, systems and targets are provided, which implement a side by side paradigm. Adjacent cells with periodic structures are used to extract the overlay error, e.g., by introducing controllable phase shifts or image shifts which enable algorithmic computation of the overlay. The periodic structures are designed to exhibit a rotational symmetry to support the computation and reduce errors.
Process-induced excursion characterization
Granted: March 10, 2020
Patent Number:
10585049
A system includes a controller with one or more processors and memory configured to store one or more sets of program instructions. The one or more processors are configured to execute the one or more sets of program instructions. The one or more sets of program instructions are configured to cause the one or more processors to apply filtering to a semiconductor wafer map; separate the filtered semiconductor wafer map into a plurality of dies; generate a set of die comparison statistics…
