Determining a configuration for an optical element positioned in a collection aperture during wafer inspection
Granted: February 26, 2019
Patent Number:
10215713
Methods and systems for determining a configuration for an optical element positioned in a collection aperture during wafer inspection are provided. One system includes a detector configured to detect light from a wafer that passes through an optical element, which includes a set of collection apertures, when the optical element has different configurations thereby generating different images for the different configurations. The system also includes a computer subsystem configured for…
Infrared spectroscopic reflectometer for measurement of high aspect ratio structures
Granted: February 26, 2019
Patent Number:
10215693
Methods and systems for performing spectroscopic reflectometry measurements of semiconductor structures at infrared wavelengths are presented herein. In some embodiments measurement wavelengths spanning a range from 750 nanometers to 2,600 nanometers, or greater, are employed. In one aspect, reflectometry measurements are performed at oblique angles to reduce the influence of backside reflections on measurement results. In another aspect, a broad range of infrared wavelengths are…
Optical metrology tool equipped with modulated illumination sources
Granted: February 26, 2019
Patent Number:
10215688
The system includes a modulatable illumination source configured to illuminate a surface of a sample disposed on a sample stage, a detector configured to detect illumination emanating from a surface of the sample, illumination optics configured to direct illumination from the modulatable illumination source to the surface of the sample, collection optics configured to direct illumination from the surface of the sample to the detector, and a modulation control system communicatively…
Method and system for measuring radiation and temperature exposure of wafers along a fabrication process line
Granted: February 26, 2019
Patent Number:
10215626
A measurement wafer device for measuring radiation intensity and temperature includes a wafer assembly including one or more cavities. The measurement wafer device further includes a detector assembly. The detector assembly includes one or more light sensors. The detector assembly is further configured to perform a direct or indirect measurement of the intensity of ultraviolet light incident on a surface of the wafer assembly.
Method for shape classification of an object
Granted: February 26, 2019
Patent Number:
10215560
A method for shape classification of an object is provided. Shape categories are provided which specify a plane and points therein relative to the object, and also specify at least one limit coordinate for each such point, the limit coordinate defining a boundary in a direction normal to the plane for the shape of the object considered in order for the object to be classified into a respective shape category. The shape categories can be provided by a user, making the method very…
Metrology of multiple patterning processes
Granted: February 26, 2019
Patent Number:
10215559
Methods and systems for evaluating the performance of multiple patterning processes are presented. Patterned structures are measured and one or more parameter values characterizing geometric errors induced by the multiple patterning process are determined. In some examples, a primary, multiple patterned target is measured and a value of a parameter of interest is directly determined from the measured data by a Signal Response Metrology (SRM) measurement model. In some other examples, a…
System and method for defect classification based on electrical design intent
Granted: February 19, 2019
Patent Number:
10209628
A method for automatically classifying one or more defects based on electrical design properties includes receiving one or more images of a selected region of a sample, receiving one or more sets of design data associated with the selected region of the sample, locating one or more defects in the one or more images of the selected region of the sample by comparing the one or more images of the selected region of the sample to the one or more sets of design data, retrieving one or more…
Determining a position of a defect in an electron beam image
Granted: February 19, 2019
Patent Number:
10211025
Methods and systems for determining a position of a defect in an electron beam image of a wafer are provided. One method includes determining a second position of a defect with respect to patterns imaged in a test image based on a first position of the defect in a difference image. The method also includes determining a third position of the defect with respect to the patterns in an electron beam image for the defect and determining an association between the first and third positions.…
Permanent-magnet particle beam apparatus and method incorporating a non-magnetic metal portion for tunability
Granted: February 19, 2019
Patent Number:
10211021
A permanent-magnet particle beam apparatus and method incorporating a non-magnetic portion for tunability are provided. The permanent-magnet particle beam apparatus includes a particle beam emitter that emits a charged particle beam, and includes a set of permanent magnets forming a magnetic field for controlling condensing of the charged particle beam. The permanent-magnet particle beam apparatus further includes a non-magnetic electrical conductor component situated with the set of…
Signal response metrology for image based and scatterometry overlay measurements
Granted: February 19, 2019
Patent Number:
10210606
Methods and systems for measuring overlay error between structures formed on a substrate by successive lithographic processes are presented herein. Two overlay targets, each having programmed offsets in opposite directions are employed to perform an overlay measurement. Overlay error is measured based on zero order scatterometry signals and scatterometry data is collected from each target at two different azimuth angles. In addition, methods and systems for creating an image-based…
Systems and methods for focus-sensitive metrology targets
Granted: February 19, 2019
Patent Number:
10209627
A lithography system includes an illumination source, projection optical elements, and a pattern mask. The illumination source includes one or more illumination poles. The pattern mask includes a set of focus-sensitive mask elements distributed with a pitch and, is configured to diffract illumination from the one or more illumination poles. The pitch may be selected such that two diffraction orders of illumination associated with each of the one or more illumination poles are…
3D microscope and methods of measuring patterned substrates
Granted: February 19, 2019
Patent Number:
10209501
A three-dimensional (3D) microscope for patterned substrate measurement can include an objective lens, a reflected illuminator, a transmitted illuminator, a focusing adjustment device, an optical sensor, and a processor. The focusing adjustment device can automatically adjust the objective lens focus at a plurality of Z steps. The optical sensor can be capable of acquiring images at each of these Z steps. The processor can control the reflected illuminator, the transmitted illuminator,…
Scatterometry system and method for generating non-overlapping and non-truncated diffraction images
Granted: February 19, 2019
Patent Number:
10209183
A scatterometry measurement system includes an objective lens with a central obscuration and an illumination source configured to illuminate a scatterometry target through the objective lens with a first illumination beam at a first illumination angle and a second illumination beam at a second illumination angle in which the scatterometry target includes periodic structures located in at least two layers. The objective lens collects at least one diffracted order from the first…
Automatic deskew using design files or inspection images
Granted: February 12, 2019
Patent Number:
10204416
Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites…
Defect review sampling and normalization based on defect and design attributes
Granted: February 12, 2019
Patent Number:
10204290
A decision tree and normalized reclassification are used to classify defects. Defect review sampling and normalization can be used for accurate Pareto ranking and defect source analysis. A defect review system, such as a broadband plasma tool, and a controller can be used to bin defects using the decision tree based on defect attributes and design attributes. Class codes are assigned to at least some of the defects in each bin. Normalized reclassification assigns a class code to any…
Systems for providing illumination in optical metrology
Granted: February 12, 2019
Patent Number:
10203247
A system for providing illumination to a measurement head for optical metrology is configured to combine illumination beams from a plurality of illumination sources to deliver illumination at one or more selected wavelengths to the measurement head. The intensity and/or spatial coherence of illumination delivered to the measurement head is controlled. Illumination at one or more selected wavelengths is delivered from a broadband illumination source configured for providing illumination…
Analyzing root causes of process variation in scatterometry metrology
Granted: February 12, 2019
Patent Number:
10203200
Method, metrology modules and RCA tool are provided, which use the behavior of resonance region(s) in measurement landscapes to evaluate and characterize process variation with respect to symmetric and asymmetric factors, and provide root cause analysis of the process variation with respect to process steps. Simulations of modeled stacks with different layer thicknesses and process variation factors may be used to enhance the analysis and provide improved target designs, improved…
Approaches in first order scatterometry overlay based on introduction of auxiliary electromagnetic fields
Granted: February 5, 2019
Patent Number:
10197389
Metrology measurement methods and tools are provided, which illuminate a stationary diffractive target by a stationary illumination source, measure a signal composed of a sum of a zeroth order diffraction signal and a first order diffraction signal, repeat the measuring for a plurality of relations between the zeroth and the first diffraction signals, while maintaining the diffractive target and the illumination source stationary, and derive the first order diffraction signal from the…
Photocathode including silicon substrate with boron layer
Granted: February 5, 2019
Patent Number:
10199197
A photocathode is formed on a monocrystalline silicon substrate having opposing illuminated (top) and output (bottom) surfaces. To prevent oxidation of the silicon, a thin (e.g., 1-5 nm) boron layer is disposed directly on the output surface using a process that minimizes oxidation and defects. An optional second boron layer is formed on the illuminated (top) surface, and an optional anti-reflective material layer is formed on the second boron layer to enhance entry of photons into the…
Electron-bombarded charge-coupled device and inspection systems using EBCCD detectors
Granted: February 5, 2019
Patent Number:
10197501
A focusing EBCCD includes a control device positioned between a photocathode and a CCD. The control device has a plurality of holes therein, wherein the plurality of holes are formed perpendicular to a surface of the photocathode, and wherein a pattern of the plurality of holes is aligned with a pattern of pixels in the CCD. Each hole is surrounded by at least one first electrode, which is formed on a surface of the control device facing the photocathode. The control device may include a…
