Electron-bombarded charge-coupled device and inspection systems using EBCCD detectors
Granted: February 5, 2019
Patent Number:
10197501
A focusing EBCCD includes a control device positioned between a photocathode and a CCD. The control device has a plurality of holes therein, wherein the plurality of holes are formed perpendicular to a surface of the photocathode, and wherein a pattern of the plurality of holes is aligned with a pattern of pixels in the CCD. Each hole is surrounded by at least one first electrode, which is formed on a surface of the control device facing the photocathode. The control device may include a…
Approaches in first order scatterometry overlay based on introduction of auxiliary electromagnetic fields
Granted: February 5, 2019
Patent Number:
10197389
Metrology measurement methods and tools are provided, which illuminate a stationary diffractive target by a stationary illumination source, measure a signal composed of a sum of a zeroth order diffraction signal and a first order diffraction signal, repeat the measuring for a plurality of relations between the zeroth and the first diffraction signals, while maintaining the diffractive target and the illumination source stationary, and derive the first order diffraction signal from the…
Metrology system, method, and computer program product employing automatic transitioning between utilizing a library and utilizing regression for measurement processing
Granted: January 29, 2019
Patent Number:
10190868
A metrology system, method, and computer program product that employ automatic transitioning between utilizing a library and utilizing regression for measurement processing are provided. In use, it is determined, by the metrology system, that a predetermined condition has been met. In response to determining that the predetermined condition has been met, the metrology system automatically transitions between utilizing a library and utilizing regression for measurement processing.
Sensor with electrically controllable aperture for inspection and metrology systems
Granted: January 29, 2019
Patent Number:
10194108
Pixel aperture size adjustment in a linear sensor is achieved by applying more negative control voltages to central regions of the pixel's resistive control gate, and applying more positive control voltages to the gate's end portions. These control voltages cause the resistive control gate to generate an electric field that drives photoelectrons generated in a selected portion of the pixel's light sensitive region into a charge accumulation region for subsequent measurement, and drives…
Semiconductor inspection and metrology system using laser pulse multiplier
Granted: January 29, 2019
Patent Number:
10193293
A pulse multiplier includes a polarizing beam splitter, a wave plate, and a set of multi-surface reflecting components (e.g., one or more etalons and one or more mirrors). The polarizing beam splitter passes input laser pulses through the wave plate to the multi-surface reflecting components, which reflect portions of each input laser pulse back through the wave plate to the polarizing beam splitter. The polarizing beam splitter reflects each reflected portion to form an output of the…
Multi-beam dark field imaging
Granted: January 29, 2019
Patent Number:
10192716
Multi-beam scanning electron microscope (SEM) inspection systems with dark field imaging capabilities are disclosed. An SEM inspection system may include an electron source and at least one optical device. The at least one optical device may be configured to produce a plurality of primary beamlets utilizing electrons provided by the electron source and deliver the plurality of primary beamlets toward a target. The apparatus may also include an array of detectors configured to receive a…
Method and system for mixed mode wafer inspection
Granted: January 29, 2019
Patent Number:
10192303
Mixed-mode includes receiving inspection results including one or more images of a selected region of the wafer, the one or more images include one or more wafer die including a set of repeating blocks, the set of repeating blocks a set of repeating cells. In addition, mixed-mode inspection includes adjusting a pixel size of the one or more images to map each cell, block and die to an integer number of pixels. Further, mixed-mode inspection includes comparing a first wafer die to a…
Combined patch and design-based defect detection
Granted: January 29, 2019
Patent Number:
10192302
Defect detection is performed by comparing a test image and a reference image with a rendered design image, which may be generated from a design file. This may occur because a comparison of the test image and another reference image was inconclusive due to noise. The results of the two comparisons with the rendered design image can indicate whether a defect is present in the test image.
Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices
Granted: January 29, 2019
Patent Number:
10190994
An apparatus, a method and a computer program product for inspecting at least side faces of a semiconductor device are disclosed. A frame construction is provided, which holds a camera, defining an imaging beam path. The semiconductor device is inserted into a mirror block. The mirror block has a first mirror, a second mirror, a third mirror and a fourth mirror, wherein the mirrors are arranged such that they surround a free space in the form of a rectangle. The opposing first mirror and…
Metrology imaging targets having reflection-symmetric pairs of reflection-asymmetric structures
Granted: January 29, 2019
Patent Number:
10190979
Metrology targets, design files, and design and production methods thereof are provided. Metrology targets comprising at least one reflection-symmetric pair of reflection-asymmetric structures are disclosed. The structures may or may not be periodic, may comprise a plurality of unevenly-spaced target elements, which may or may not be segmented. The asymmetry may be with respect to target element segmentation or structural dimensions. Also, target design files and metrology measurements…
Method and system for focus adjustment of a multi-beam scanning electron microscopy system
Granted: January 22, 2019
Patent Number:
10186396
A scanning electron microscopy system is disclosed. The system includes a multi-beam scanning electron microscopy (SEM) sub-system. The SEM sub-system includes a multi-beam electron source configured to form a plurality of electron beams, a sample stage configured to secure a sample, an electron-optical assembly to direct the electron beams onto a portion of the sample, and a detector assembly configured to simultaneously acquire multiple images of the surface of the sample. The system…
Defect signal to noise enhancement by reducing die to die process noise
Granted: January 22, 2019
Patent Number:
10186028
Gray level histograms for a test image and a reference image are adjusted by histogram scaling. Parameters from the histogram scaling are applied to the test image and the reference image. After the parameters are applied, the reference image and the test image are compared to produce a difference image, such as by subtracting the reference image from the test image. Noise in the difference image can be reduced, which improves defect identification in the difference image. In addition,…
Single image detection
Granted: January 22, 2019
Patent Number:
10186026
Methods and systems for detecting defects on a specimen are provided. One system includes a generative model. The generative model includes a non-linear network configured for mapping blocks of pixels of an input feature map volume into labels. The labels are indicative of one or more defect-related characteristics of the blocks. The system inputs a single test image into the generative model, which determines features of blocks of pixels in the single test image and determines labels…
Apparatus and method for the measurement of pattern placement and size of pattern and computer program therefor
Granted: January 22, 2019
Patent Number:
10185800
An apparatus and a method are disclosed for the measurement of pattern placement and/or edge placement and/or size of a pattern on a surface of a substrate for the semiconductor industry. At least one source for detection and at least one assigned detector are used to measure the positions of a pattern on a substrate. With a movable stage the substrate is moved while detection takes place. A displacement measurement system determines the position of the movable stage during the movement.…
Optimizing computational efficiency by multiple truncation of spatial harmonics
Granted: January 22, 2019
Patent Number:
10185303
Methods and systems for solving measurement models of complex device structures with reduced computational effort and memory requirements are presented. The computational efficiency of electromagnetic simulation algorithms based on truncated spatial harmonic series is improved for periodic targets that exhibit a fundamental spatial period and one or more approximate periods that are integer fractions of the fundamental spatial period. Spatial harmonics are classified according to each…
Image based specimen process control
Granted: January 15, 2019
Patent Number:
10181185
Methods and systems for detecting anomalies in images of a specimen are provided. One system includes one or more computer subsystems configured for acquiring images generated of a specimen by an imaging subsystem. The computer subsystem(s) are also configured for determining one or more characteristics of the acquired images. In addition, the computer subsystem(s) are configured for identifying anomalies in the images based on the one or more determined characteristics without applying…
System and method for high throughput work-in-process buffer
Granted: January 8, 2019
Patent Number:
10177020
A buffer system for a semiconductor device fabrication tool includes one or more retractable shelves, one or more sliding assemblies positionable above the one or more load ports of the semiconductor device fabrication tool, and one or more lifting assemblies. The one or more retractable shelves are configured to support sealable containers. The one or more sliding assemblies are configured to receive the sealable containers and are further configured to transport the sealable containers…
Structure for achieving dimensional stability during temperature changes
Granted: January 1, 2019
Patent Number:
10168261
A heated or cooled sample holding stage for use in a nanoindentation measurement system is described. The geometry of the design and the selection of materials minimizes movement of a sample holder with respect to a nanoindentation tip over a wide range of temperatures. The system controls and minimizes motion of the sample holder due to the heating or cooling of the tip holder and/or the sample holder in a high temperature nanoindentation system. This is achieved by a combination of…
Optical measurement of bump hieght
Granted: January 1, 2019
Patent Number:
10168524
A method of generating 3D information including: varying the distance between the sample and an objective lens of the optical microscope at pre-determined steps; capturing an image at each pre-determined step; determining a characteristic value of each pixel in each captured image; determining, for each captured image, the greatest characteristic value across a first portion of pixels in the captured image; comparing the greatest characteristic value for each captured image to determine…
Methods and apparatus for polarizing reticle inspection
Granted: January 1, 2019
Patent Number:
10168273
Disclosed are methods and apparatus for measuring and controlling polarization for inspection of a semiconductor sample. The method includes (i) setting up an inspection system in a specific mode of operation, (ii) incrementing a first waveplate of the system through a plurality of rotations while keeping a second waveplate of the system static, (iii) measuring an intensity signal from non-patterned areas of the sample for each rotation of the first waveplate, (iv) incrementing the…
