ELECTRONIC DEVICE APPARATUS WITH MULTIPLE THERMALLY CONDUCTIVE PATHS FOR HEAT DISSIPATION
Granted: May 14, 2020
Application Number:
20200152546
Examples described herein provide for an electronic device apparatus with multiple thermally conductive paths for heat dissipation. In an example, an electronic device apparatus includes a package comprising a die attached to a package substrate. The electronic device apparatus further includes a ring stiffener disposed around the die and on the package substrate, a heat sink disposed on the package, and a wedge disposed between the heat sink and the ring stiffener.
STREAMING PLATFORM ARCHITECTURE FOR INTER-KERNEL CIRCUIT COMMUNICATION FOR AN INTEGRATED CIRCUIT
Granted: May 14, 2020
Application Number:
20200151120
An integrated circuit (IC) includes a first kernel circuit implemented in programmable circuitry, a second kernel circuit implemented in programmable circuitry, and a stream traffic manager circuit coupled to the first kernel circuit and the second kernel circuit. The stream traffic manager circuit is configured to control data streams exchanged between the first kernel circuit and the second kernel circuit.
NETWORK INTERFACE DEVICE
Granted: May 7, 2020
Application Number:
20200145376
A network interface device having a hardware module comprising a plurality of processing units. Each of the plurality of processing units is associated with its own at least one predefined operation. At a compile time, the hardware module is configured by arranging at least some of the plurality of processing units to perform their respective at least one operation with respect to a data packet in a certain order so as to perform a function with respect to that data packet. A compiler is…
CRYPTOGRAPHIC SYSTEM
Granted: May 7, 2020
Application Number:
20200143088
A circuit arrangement includes an encryption circuit and a decryption circuit. A cryptographic shell circuit has a transmit channel and a receive channel in parallel with the transmit channel. The transmit channel includes an encryption interface circuit coupled to the encryption circuit. The encryption interface circuit determines first cryptographic parameters based on data in a plaintext input packet and inputs the first cryptographic parameters and plaintext input packet to the…
TEST SYSTEM AND METHOD OF TESTING A WAFER FOR INTEGRATED CIRCUIT DEVICES
Granted: May 7, 2020
Application Number:
20200141976
A test system for testing a wafer for integrated circuit devices is described. The test system comprises a first plurality of test probes adapted to make electrical contacts to first corresponding contacts of a wafer tested by the test system; a second plurality of test probes adapted to make electrical contacts to second corresponding contacts on a perimeter region of a portion of the wafer tested by the test system; and a control circuit coupled to the first plurality of test probes…
NETWORK INTERFACE DEVICE
Granted: April 2, 2020
Application Number:
20200106668
A network interface device comprises a plurality of components configured to process a flow of data one after another. A control component is configured to provide one or more control messages in said flow, said one or more control message being provided to said plurality of components one after another such that a configuration of one or more of said components is changed.
STACKED SILICON PACKAGE ASSEMBLY HAVING THERMAL MANAGEMENT
Granted: April 2, 2020
Application Number:
20200105642
A chip package assembly and method for fabricating the same are provided which utilize a plurality of extra-die heat transfer posts for improved thermal management. In one example, a chip package assembly is provided that includes a first integrated circuit (IC) die mounted to a substrate, a cover disposed over the first IC die, and a plurality of extra-die conductive posts disposed between the cover and substrate. The extra-die conductive posts provide a heat transfer path between the…
TRAINING OF NEURAL NETWORKS BY INCLUDING IMPLEMENTATION COST AS AN OBJECTIVE
Granted: April 2, 2020
Application Number:
20200104715
An example method of implementing a neural network includes selecting a first neural network architecture from a search space and training the neural network having the first neural network architecture to obtain an accuracy and an implementation cost. The implementation cost is based on a programmable device of an inference platform. The method further includes selecting a second neural network architecture from the search space based on the accuracy and the implementation cost, and…
LATENCY SYNCHRONIZATION ACROSS CLOCK DOMAINS
Granted: March 26, 2020
Application Number:
20200097038
Methods and apparatus for tracking delay in signals sent from a first clock domain to a second clock domain are disclosed. For example, at a first time a common timing reference signal (SysRef) may be received at the first clock domain, and a latency marker may be input into a first-in first-out data structure (FIFO) coupling the first clock domain to the second clock domain. At a second time, the SysRef may be received at the second clock domain, and a timer may be started at the second…
PARTIAL RECONFIGURATION FOR NETWORK-ON-CHIP (NOC)
Granted: March 19, 2020
Application Number:
20200092230
Examples described herein provide for an electronic circuit, such as a System-on-Chip (SoC), having a Network-on-Chip (NoC). The NoC is configurable and has capabilities to be partially reconfigured. In an example, a NoC on an integrated circuit is configured. Subsystems on the integrated circuit communicate via the NoC. The NoC is partially reconfigured. A first subset of the NoC is reconfigured during the partial reconfiguration, and a second subset of the NoC is capable of continuing…
SINGLE EVENT LATCH-UP (SEL) MITIGATION DETECT AND MITIGATION
Granted: March 19, 2020
Application Number:
20200091713
An integrated circuit (IC) chip having circuitry adapted to detect and unlatch a latched transistor, and methods for operating the same are provided. In one example, an IC chip includes a body, a power rail disposed in the body and coupled to at least one of a plurality of contract pads disposed on the body, and a first core circuit disposed in the body. The first core circuit includes a first current limiting circuit, a silicon controlled rectifier (SCR) device having a first…
MULTIPLY AND ACCUMULATE CIRCUIT
Granted: March 19, 2020
Application Number:
20200089472
Circuits and method for multiplying floating point operands. An exponent adder circuit sums a first exponent and a second exponent and generates an output exponent. A mantissa multiplier circuit multiplies a first mantissa and a second mantissa and generates an output mantissa. A first conversion circuit converts the output exponent and output mantissa into a fixed point number. An accumulator circuit sums contents of an accumulation register and the fixed point number into an…
UNIFIED ADDRESS SPACE FOR MULTIPLE HARDWARE ACCELERATORS USING DEDICATED LOW LATENCY LINKS
Granted: March 12, 2020
Application Number:
20200081850
A system may include a host processor coupled to a communication bus, a first hardware accelerator communicatively linked to the host processor through the communication bus, and a second hardware accelerator communicatively linked to the host processor through the communication bus. The first hardware accelerator and the second hardware accelerator are directly coupled through an accelerator link independent of the communication bus. The host processor is configured to initiate a data…
VECTORIZED PEAK DETECTION FOR SIGNAL PROCESSING
Granted: March 5, 2020
Application Number:
20200076660
Techniques related to a data processing engine for an integrated circuit (IC) are described. In an example, a method is provided for vectorized peak detection. The method includes dividing a set of data samples of a data signal, corresponding to a peak detection window (PDW), into a plurality of subsets of data samples each comprising a number of data samples. The method includes performing vector operations on each of the plurality of subsets of data samples. The method includes…
POWER GATING IN STACKED DIE STRUCTURES
Granted: March 5, 2020
Application Number:
20200076424
Examples of the present disclosure provide power gating for stacked die structures. In some examples, a stacked die structure comprises a first die and a second die bonded to the first die. In some examples, a power gated power path is from a bonding interface between the dies through TSVs in the second die, a power gating device in the second die, and routing of metallization layers in the second die to the circuit region in the second die. In some examples, a power gated power path…
SINGLE EVENT LATCH-UP (SEL) MITIGATION TECHNIQUES
Granted: February 27, 2020
Application Number:
20200066837
Examples described herein provide for single event latch-up (SEL) mitigation techniques. In an example, a semiconductor structure includes a semiconductor substrate, a p-type transistor having p+ source/drain regions disposed in a n-doped region in the semiconductor substrate, an n-type transistor having n+ source/drain regions disposed in a p-doped region in the semiconductor substrate, a n+ guard ring disposed in the n-doped region and laterally around the p+ source/drain regions of…
SINGLE EVENT LATCH-UP (SEL) MITIGATION TECHNIQUES
Granted: February 27, 2020
Application Number:
20200066713
Examples described herein provide for single event latch-up (SEL) mitigation techniques. In an example, a circuit includes a semiconductor substrate, a first transistor, a second transistor, and a ballast resistor. The semiconductor substrate comprises a p-doped region and an n-doped region. The first transistor comprises an n+ doped source region disposed in the p-doped region of the semiconductor substrate. The second transistor comprises a p+ doped source region disposed in the…
LOGICAL TRANSPORT OVER A FIXED PCIE PHYSICAL TRANSPORT NETWORK
Granted: February 6, 2020
Application Number:
20200044895
A method and a system for transparently overlaying a logical transport network over an existing physical transport network is disclosed. The system designates a virtual channel located in a first transaction layer of a network conforming to a first network protocol. The system assembles a transaction layer packet in a second logical transaction layer of a second network protocol that is also recognizable by the first transaction layer. The system transfers the transaction layer packet…
HYBRID PRECISE AND IMPRECISE CACHE SNOOP FILTERING
Granted: February 6, 2020
Application Number:
20200042446
Circuits and methods for combined precise and imprecise snoop filtering. A memory and a plurality of processors are coupled to the interconnect circuitry. A plurality of cache circuits are coupled to the plurality of processor circuits, respectively. A first snoop filter is coupled to the interconnect and is configured to filter snoop requests by individual cache lines of a first subset of addresses of the memory. A second snoop filter is coupled to the interconnect and is configured to…
CHIP PACKAGE ASSEMBLY WITH ENHANCED INTERCONNECTS AND METHOD FOR FABRICATING THE SAME
Granted: January 30, 2020
Application Number:
20200035635
An integrated circuit interconnects are described herein that are suitable for forming integrated circuit chip packages. In one example, an integrated circuit interconnect is embodied in a wafer that includes a substrate having a plurality of integrated circuit (IC) dice formed thereon. The plurality of IC dice include a first IC die having first solid state circuitry and a second IC die having second solid state circuitry. A first contact pad is disposed on the substrate and is coupled…
