HIERARCHICAL PARTIAL RECONFIGURATION FOR PROGRAMMABLE INTEGRATED CIRCUITS
Granted: January 23, 2020
Application Number:
20200028511
Hierarchical partial reconfiguration for integrated circuits includes converting, using computer hardware, a first partial reconfiguration module of a circuit design into a first partial reconfiguration container, wherein the circuit design is placed and routed, loading, using the computer hardware, a first netlist into the first partial reconfiguration container, wherein the first netlist includes a first plurality of partial reconfiguration modules that are initially empty, and…
PERFORMING CONSECUTIVE MAC OPERATIONS ON A SET OF DATA USING DIFFERENT KERNELS IN A MAC CIRCUIT
Granted: January 23, 2020
Application Number:
20200026989
A circuit arrangement includes an array of MAC circuits, wherein each MAC circuit includes a cache configured for storage of a plurality of kernels. The MAC circuits are configured to receive a first set of data elements of an IFM at a first rate. The MAC circuits are configured to perform first MAC operations on the first set of the data elements and a first one of the kernels associated with a first OFM depth index during a first MAC cycle, wherein a rate of MAC cycles is faster than…
CONFIGURABLE NETWORK-ON-CHIP FOR A PROGRAMMABLE DEVICE
Granted: January 23, 2020
Application Number:
20200026684
An example programmable integrated circuit (IC) includes a processor, a plurality of endpoint circuits, a network-on-chip (NoC) having NoC master units (NMUs), NoC slave units (NSUs), NoC programmable switches (NPSs), a plurality of registers, and a NoC programming interface (NPI). The processor is coupled to the NPI and is configured to program the NPSs by loading an image to the registers through the NPI for providing physical channels between NMUs to the NSUs and providing data paths…
INTEGRATED CIRCUIT DIE WITH IN-CHIP HEAT SINK
Granted: January 2, 2020
Application Number:
20200006186
A method and apparatus are provided that includes an integrated circuit die having an in-chip heat sink, along with an electronic device and a chip package having the same, and methods for fabricating the same. In one example, an integrated circuit die has an in-chip heat sink that separates a high heat generating integrated circuit from another integrated circuit disposed within the die. The in-chip heat sink provides a highly conductive heat transfer path from interior portions of the…
HARDWARE-BASED VIRTUAL-TO-PHYSICAL ADDRESS TRANSLATION FOR PROGRAMMABLE LOGIC MASTERS IN A SYSTEM ON CHIP
Granted: December 26, 2019
Application Number:
20190391929
An example programmable integrated circuit (IC) includes a processing system having a processor, a master circuit, and a system memory management unit (SMMU). The SMMU includes a first translation buffer unit (TBU) coupled to the master circuit, an address translation (AT) circuit, an AT interface coupled to the AT circuit, and a second TBU coupled to the AT circuit, and programmable logic coupled to the AT circuit in the SMMU through the AT interface.
MULTI-CHIP STRUCTURE HAVING CONFIGURABLE NETWORK-ON-CHIP
Granted: November 28, 2019
Application Number:
20190363717
A multi-chip structure that implements a configurable Network-on-Chip (NoC) for communication between chips is described herein. In an example, an apparatus includes a first chip comprising a first processing system and a first configurable NoC connected to the first processing system, and includes a second chip comprising a second processing system and a second configurable NoC connected to the second processing system. The first and second configurable NoCs are connected together via…
EMBEDDED SCHEDULING OF HARDWARE RESOURCES FOR HARDWARE ACCELERATION
Granted: November 28, 2019
Application Number:
20190361708
An integrated circuit (IC) may include a scheduler for hardware acceleration. The scheduler may include a command queue having a plurality of slots and configured to store commands offloaded from a host processor for execution by compute units of the IC. The scheduler may include a status register having bit locations corresponding to the slots of the command queue. The scheduler may also include a controller coupled to the command queue and the status register. The controller may be…
REDUNDANCY SCHEME FOR A 3D STACKED DEVICE
Granted: October 31, 2019
Application Number:
20190333892
Examples herein describe techniques for forming 3D stacked devices which include a redundant logical layer. The 3D stacked devices include a plurality of semiconductor chips stacked in a vertical direction such that each chip is bonded to a chip above, below, or both in the stack. In one embodiment, each chip is the same—e.g., has the same circuitry arranged in the same configuration in the chip. The 3D stacked device provides a redundant logic layer by dividing the chips into a…
SOFTWARE DEFINED MULTI-DOMAIN CREATION AND ISOLATION FOR A HETEROGENEOUS SYSTEM-ON-CHIP
Granted: October 24, 2019
Application Number:
20190324806
Multi-domain creation and isolation within a heterogeneous System-on-Chip (SoC) may include receiving a hardware description file specifying a plurality of processors and a plurality of hardware resources available within a heterogeneous SoC and creating, using computer hardware, a plurality of domains for the heterogeneous SoC, wherein each domain includes a processor selected from the plurality of processors and a hardware resource selected from the plurality of hardware resources. The…
CHIP SCALE PACKAGE (CSP) INCLUDING SHIM DIE
Granted: October 17, 2019
Application Number:
20190318975
Examples of the present disclosure provide example Chip Scale Packages (CSPs). In some examples, a structure includes a first integrated circuit die, a shim die that does not include active circuitry thereon, an encapsulant at least laterally encapsulating the first integrated circuit die and the shim die, and a redistribution structure on the first integrated circuit die, the shim die, and the encapsulant. The redistribution structure includes one or more metal layers electrically…
DATA PROCESSING ENGINE TILE ARCHITECTURE FOR AN INTEGRATED CIRCUIT
Granted: October 3, 2019
Application Number:
20190303347
An example data processing engine (DPE) for a DPE array in an integrated circuit (IC) includes: a core; a memory including a data memory and a program memory, the program memory coupled to the core, the data memory coupled to the core and including at least one connection to a respective at least one additional core external to the DPE; support circuitry including hardware synchronization circuitry and direct memory access (DMA) circuitry each coupled to the data memory; streaming…
SYSTEM-ON-CHIP INTERFACE ARCHITECTURE
Granted: October 3, 2019
Application Number:
20190303328
A device may include a plurality of data processing engines, a subsystem, and an SoC interface block coupled to the plurality of data processing engines and the subsystem. The SoC interface block may be configured to exchange data between the subsystem and the plurality of data processing engines.
PERIPHERAL INTERCONNECT FOR CONFIGURABLE SLAVE ENDPONT CIRCUITS
Granted: October 3, 2019
Application Number:
20190303323
A peripheral interconnect for configuring slave endpoint circuits, such as may be in a configurable network, in a system-on-chip (SoC) is described herein. In an example, an apparatus includes a processing system on a chip, a circuit block on the chip, and a configurable network on the chip. The processing system and the circuit block are connected to the configurable network. The configurable network includes a peripheral interconnect. The peripheral interconnect includes a root node…
DEVICE WITH DATA PROCESSING ENGINE ARRAY
Granted: October 3, 2019
Application Number:
20190303311
A device may include a plurality of data processing engines. Each data processing engine may include a core and a memory module. Each core may be configured to access the memory module in the same data processing engine and a memory module within at least one other data processing engine of the plurality of data processing engines.
DEBUG CONTROLLER CIRCUIT
Granted: October 3, 2019
Application Number:
20190303268
A circuit arrangement includes one or more input buffers disposed on a system-on-chip (SoC) and configured to receive and store streaming debug packets. One or more response buffers are also disposed on the SoC. A transaction control circuit is disposed on the SoC and is configured to process each debug packet in the one or more input buffers. The processing includes decoding an operation code in the debug packet, and determining from an address in the debug packet, an interface circuit…
DATA PROCESSING ENGINE ARRANGEMENT IN A DEVICE
Granted: October 3, 2019
Application Number:
20190303033
A device may include a plurality of data processing engines. Each of the data processing engines may include a core and a memory module. The plurality of data processing engines may be organized in a plurality of rows. Each core may be configured to communicate with other neighboring data processing engines of the plurality of data processing engines by shared access to the memory modules of the neighboring data processing engines.
CIRCUIT FOR AND METHOD OF RECEIVING A SIGNAL IN AN INTEGRATED CIRCUIT DEVICE
Granted: September 19, 2019
Application Number:
20190288830
A circuit for receiving a signal in an integrated circuit is described. The circuit comprises a sampler configured to receive an input data signal, wherein the sampler generates sampled data and a recovered clock; a clock and data recovery circuit configured to receive the sampled data and the recovered clock and to generate a phase interpolator code; and a phase interpolator configured to receive the phase interpolator code; wherein the phase interpolator generates multiple phase…
MITIGATION FOR FINFET TECHNOLOGY USING DEEP ISOLATION
Granted: September 12, 2019
Application Number:
20190280086
FinFET, P-N junctions and methods for forming the same are described herein. In one example, a FinFET transistor is described that includes a fin having a channel region wrapped by a gate, the channel region connecting a source and a drain. A first isolation layer is disposed on a first side of the in and a second isolation layer is disposed on a second side of the fin, where the second side is opposite of the first side. The second oxide isolation layer has a thickness greater than a…
PROGRAMMABLE NOC COMPATIBLE WITH MULTIPLE INTERFACE COMMUNICATION PROTOCOL
Granted: August 29, 2019
Application Number:
20190266125
Embodiments herein describe a SoC that includes a programmable NoC that can be reconfigured to support different interface communication protocols. In one embodiment, the NoC includes ingress and egress logic blocks which permit hardware elements in the SoC (e.g., processors, memory, programmable logic blocks, etc.) to transmit and receive data using the NoC. The ingress and egress logic blocks may first be configured to support a particular communication protocol for interfacing with…
DIE SINGULATION AND STACKED DEVICE STRUCTURES
Granted: August 29, 2019
Application Number:
20190267287
Techniques for singulating dies from a respective workpiece and for incorporating one or more singulated die into a stacked device structure are described herein. In some examples, singulating a die from a workpiece includes chemically etching the workpiece in a scribe line. In some examples, singulating a die from a workpiece includes mechanically dicing the workpiece in a scribe line and forming a liner along a sidewall of the die. The die can be incorporated into a stacked device…
