Applied Materials Patent Grants

Sputter target for a physical vapor deposition chamber

Granted: December 3, 2024
Patent Number: D1053230

Predictive wafer scheduling for multi-chamber semiconductor equipment

Granted: November 26, 2024
Patent Number: 12154804
A method includes identifying a set of wafers, wherein each wafer is associated with a respective start time of a set of start times, determining whether the set of wafers includes an idle wafer, in response to determining that the set of wafers includes an idle wafer that is idle for a duration that exceeds a predefined threshold value, generating a modified set of start times by modifying at least the start time for the idle wafer, and initiating a computer simulation forecasting…

Ion source having different modes of operation

Granted: November 26, 2024
Patent Number: 12154766
An ion source that is capable of different modes of operation is disclosed. A vaporizer is in communication with the ion source. The ion source may have several gas inlets, in communication with different gasses. When operating in a first mode, the ion source may supply a first gas, such as an inert gas, while heating the vaporizer. When operating in a second mode, the ion source may supply a second gas, which may be an organoaluminium gas. When operating in a third mode, the ion source…

Toroidal motion enhanced ion source

Granted: November 26, 2024
Patent Number: 12154755
An IHC ion source having increased plasma potential is disclosed. In certain embodiments, the extraction plate is biased at a higher voltage than the body of the arc chamber to achieve the higher plasma potential. Shielding electrodes may be utilized to remove the interaction between the biased extraction plate and the plasma. The cross-section of the arc chamber may be circular or nearly circular to facilitate the rotation of electrons in the chamber. In another embodiment, biased…

Molten liquid transport for tunable vaporization in ion sources

Granted: November 26, 2024
Patent Number: 12154754
An ion source with a crucible is disclosed. In some embodiments, the crucible contains a solid dopant material, such as a metal. A porous wicking tip is disposed in the crucible in contact with the solid dopant material. The porous wicking tip may be a tube with one or more interior conduits. Alternatively, the porous tip may be two concentric cylinders with a plurality of rods disposed in the annular ring between the two cylinders. Alternatively, the porous tip may be one or more foil…

Device to control uniformity of extracted ion beam

Granted: November 26, 2024
Patent Number: 12154753
An ion source capable of extracting a ribbon ion beam with improved uniformity is disclosed. One of the walls of the ion source has a protrusion on its interior surface facing the chamber. The protrusion creates a loss area that serves as a sink for free electrons and ions. This causes a reduction in plasma density near the protrusion, and may improve the uniformity of the ribbon ion beam that is extracted from the ion source by modifying the beam current near the protrusion. The shape…

Lithography method to form structures with slanted angle

Granted: November 26, 2024
Patent Number: 12153344
The present disclosure generally relates to methods of forming optical devices comprising nanostructures disposed on transparent substrates. A first process of forming the nanostructures comprises depositing a first layer of a first material on a glass substrate, forming one or more trenches in the first layer, and depositing a second layer of a second material in the one or more holes to trenches a first alternating layer of alternating first portions of the first material and second…

Multiple-channel showerhead design and methods in manufacturing

Granted: November 26, 2024
Patent Number: 12152302
A method and apparatus for producing a gas distribution apparatus are described herein. More specifically, a method and apparatus for producing triple-channel gas distribution apparatus is described herein. The gas distribution apparatus described herein includes an upper plate, a middle plate, and a lower plate. The middle plate and the lower plate are machined before all of the upper plate, the middle plate, and the lower plate are bonded. Additional machining is then performed on the…

Gas diffuser

Granted: November 26, 2024
Patent Number: D1052548

Low resistance and high reliability metallization module

Granted: November 19, 2024
Patent Number: 12148660
Provided are methods of forming vias with decreased resistance by selectively depositing a barrier layer on an insulating layer and not on a metallic surface. Some embodiments of the disclosure utilize a planar hydrocarbon to form a blocking layer on metallic surfaces. Deposition is performed to selectively deposit on the unblocked insulating surfaces.

Single-slot tubular cathode

Granted: November 19, 2024
Patent Number: D1051838

Integrated substrate measurement system

Granted: November 19, 2024
Patent Number: 12148647
An apparatus includes a substrate holder, a first actuator to rotate the substrate holder, a second actuator to move the substrate holder linearly, a first sensor to generate one or more first measurements or images of the substrate, a second sensor to generate one or more second measurements of target positions on the substrate, and a processing device. The processing device estimates a position of the substrate on the substrate holder and causes the first actuator to rotate the…

Selection gate separation for 3D NAND

Granted: November 19, 2024
Patent Number: 12148475
Described is a memory string including at least one select gate for drain (SGD) transistor and at least one memory transistor in a vertical hole extending through a memory stack on a substrate. The memory stack comprises alternating word lines and dielectric material. There is at least one select-gate-for-drain (SGD) transistor in a first vertical hole extending through the memory stack, the select-gate-for-drain (SGD) transistor comprising a first gate material. At least one memory…

Training a machine learning system to detect an excursion of a CMP component using time-based sequence of images

Granted: November 19, 2024
Patent Number: 12148149
Monitoring operations of a polishing system includes obtaining a time-based sequence of reference images of a component of the polishing system performing operations during a test operation of the polishing system, receiving from a camera a time-based sequence of monitoring images of an equivalent component of an equivalent polishing system performing operations during polishing of a substrate, determining a difference value for the time-based sequence of monitoring images by comparing…

Thickness measurement of substrate using color metrology

Granted: November 19, 2024
Patent Number: 12148148
A metrology system for obtaining a measurement representative of a thickness of a layer on a substrate includes a camera positioned to capture a color image of at least a portion of the substrate. A controller is configured to receive the color image from the camera, store a predetermined path in a coordinate space of at least two dimension including a first color channel and a second color channel, store a function that provides a value representative of a thickness as a function of a…

Diagnostic methods for substrate manufacturing chambers using physics-based models

Granted: November 19, 2024
Patent Number: 12147212
A method includes receiving first sensor data, generated during a manufacturing process by sensors associated with a substrate manufacturing chamber. The method further includes receiving simulated sensor data generated by a trained physics-based model. The method further includes determining which one or more components of the manufacturing chamber contribute to a difference between the first sensor data and the simulated sensor data. The method further includes causing performance of a…

Plating and deplating currents for material co-planarity in semiconductor plating processes

Granted: November 19, 2024
Patent Number: 12146235
A method of plating substrates may include placing a substrate in a plating chamber comprising a liquid, and applying a current to the liquid in the plating chamber to deposit a metal on exposed portions of the substrate, where the current may include alternating cycles of a forward plating current and a reverse deplating current. To determine the current characteristics, a model of a substrate may be simulated during the plating process to generate data points that relate…

Flow control features of CVD chambers

Granted: November 19, 2024
Patent Number: 12146219
Apparatus and methods for gas distribution assemblies are provided. In one aspect, a gas distribution assembly is provided comprising an annular body comprising an annular ring having an inner annular wall, an outer wall, an upper surface, and a bottom surface, an upper recess formed into the upper surface, and a seat formed into the inner annular wall, an upper plate positioned in the upper recess, comprising a disk-shaped body having a plurality of first apertures formed therethrough,…

Particle coating methods and apparatus

Granted: November 19, 2024
Patent Number: 12146217
A reactor for coating particles includes a vacuum chamber configured to hold particles to be coated, a vacuum port to exhaust gas from the vacuum chamber via the outlet of the vacuum chamber, a chemical delivery system configured to flow a process gas into the particles via a gas inlet on the vacuum chamber, one or more vibrational actuators located on a first mounting surface of the vacuum chamber, and a controller configured to cause the one or more vibrational actuators to generate a…

Confinement liner for a substrate processing chamber

Granted: November 19, 2024
Patent Number: D1051867