RTP substrate temperature one for all control algorithm
Granted: December 17, 2024
Patent Number:
12169098
Embodiments disclosed herein include a method of processing a substrate. In an embodiment, the method comprises detecting one or more substrate parameters of a substrate in a processing chamber, and heating the substrate to a first temperature with an open loop tuning (OLT) heating process based on the one or more substrate parameters. In an embodiment, the method may further comprise placing the substrate on an edge ring, and heating the substrate to a second temperature with a low…
Optical resolution measurement method for optical devices
Granted: December 10, 2024
Patent Number:
12165341
Embodiments herein provide for a method of determining an optical device modulation transfer function (MTF). The method described herein includes projecting a baseline image of a pattern from a light engine to a detector. The baseline image is analyzed to determine a baseline function. A baseline fast Fourier transform (FFT) or a baseline MTF of the baseline function is obtained. The method further includes projecting an image of the pattern from the light engine to one or more optical…
Substrate enclosure system with assembly for charging a validation wafer
Granted: December 10, 2024
Patent Number:
12166366
A system includes an enclosure configured to couple to an equipment front end module (EFEM) of a substrate processing system, a charging assembly, and one or more support structures within the enclosure. The one or more support structures are configured to support a validation wafer in a charging position to charge the validation wafer via the charging assembly.
Substrate processing monitoring
Granted: December 10, 2024
Patent Number:
12165934
A method for processing a substrate within a processing chamber comprises receiving a first radiation signal corresponding to a film on a target element disposed within the processing chamber, analyzing the first radiation signal, and controlling the processing of the substrate based on the analyzed first radiation signal. The processing chamber includes a substrate support configured to support the substrate within a processing volume and a controller coupled to a first sensing device…
Apparatus for rotating substrates
Granted: December 10, 2024
Patent Number:
12165907
Embodiments of the present disclosure generally relate to apparatus for substrate processing, and more specifically to apparatus for rotating substrates and to uses thereof. In an embodiment, an apparatus for rotating a substrate is provided. The apparatus includes a levitatable rotor comprising a plurality of magnets embedded therein, a plurality of gas bearings positioned to levitate the levitatable rotor, and a stator magnetically coupled to the levitatable rotor, the stator for…
Process kit enclosure system
Granted: December 10, 2024
Patent Number:
12165905
A process kit enclosure system includes surfaces to enclose an interior volume, a first support structure including first fins, a second support structure including second fins, and a front interface to interface the process kit enclosure system with a load port of a wafer processing system. The first and second fins are sized and spaced to hold process kit ring carriers and process kit rings in the interior volume. Each of the process kit rings is secured to one of the process kit ring…
Bipolar electrostatic chuck for etch chamber
Granted: December 10, 2024
Patent Number:
12165899
Embodiments of bipolar electrostatic chucks are provided herein. In some embodiments, a bipolar electrostatic chuck includes a ceramic plate; a plurality of electrodes disposed in the ceramic plate, wherein the plurality of electrodes include one or more positive electrodes arranged in a first pattern and one or more negative electrodes arranged in a second pattern; an aluminum base plate coupled to the ceramic plate; a positive conduit extending through the aluminum base plate and…
Methods for etching a material layer for semiconductor applications
Granted: December 10, 2024
Patent Number:
12165877
An apparatus and method for etching a material layer with a cyclic etching and deposition process. The method for etching a material layer on a substrate includes: (a) etching at least a portion of a material layer (302) on a substrate (101) in an etch chamber (100) to form an open feature (360) having a bottom surface (312) and sidewalls in the material layer (302); (b) forming a protection layer (314) on the sidewalls and the bottom surface (312) of the open feature (360) from a…
Cover ring to mitigate carbon contamination in plasma doping chamber
Granted: December 10, 2024
Patent Number:
12165852
A plasma doping system including a plasma doping chamber, a platen mounted in the plasma doping chamber for supporting a workpiece, a source of ionizable gas coupled to the chamber, the ionizable gas containing a desired dopant for implantation into the workpiece, a plasma source for producing a plasma having a plasma sheath in a vicinity of the workpiece, the plasma containing positive ions of the ionizable gas, and accelerating said positive ions across the plasma sheath toward the…
Fleetwide impedance tuning performance optimization
Granted: December 10, 2024
Patent Number:
12165843
Embodiments disclosed herein include a method for field adjusting calibrating factors of a plurality of RF impedance matches for control of a plurality of plasma chambers. In an embodiment, the method comprises collecting and storing in a memory data from operation of the plurality of RF impedance matches, and finding a tune space for each of the plurality of RF impedance matches from the collected data. In an embodiment, the method further comprises finding adjustments to account for…
Capacitive sensor housing for chamber condition monitoring
Granted: December 10, 2024
Patent Number:
12163911
Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-digital converter (CDC) electrically coupled to the first electrode and the second electrode. In an embodiment, the housing assembly is attached to the sensor module and comprises a shaft,…
Digital holography for alignment in layer deposition
Granted: December 10, 2024
Patent Number:
12163783
An organic light-emitting diode (OLED) deposition system has a workpiece transport system configured to position a workpiece within the OLED deposition system under vacuum conditions, a deposition chamber configured to deposit a first layer of organic material onto the workpiece, a metrology system having one or more sensors measure of the workpiece after deposition in the deposition chamber, and a control system to control a deposition of the layer of organic material onto the…
Multi zone spot heating in EPI
Granted: December 10, 2024
Patent Number:
12163229
Embodiments of the present disclosure generally relate to apparatus and methods for semiconductor processing, more particularly, to a thermal process chamber. The thermal process chamber includes a substrate support, a first plurality of heating elements disposed over or below the substrate support, and a spot heating module disposed over the substrate support. The spot heating module is utilized to provide local heating of cold regions on a substrate disposed on the substrate support…
Continuous liner for use in a processing chamber
Granted: December 10, 2024
Patent Number:
12163218
A processing chamber includes a chamber body defining an interior volume and including an access port. A cathode assembly is configured to generate a plasma within the interior volume. A chamber liner includes one or more inner notch structures to engage with one or more components of the chamber body. The chamber liner is configured to move between a loading position and an operation position. When the chamber liner is in the loading position, the interior volume is accessible by the…
Substrate processing system for processing of a plurality of substrates and method of processing a substrate in an in-line substrate processing system
Granted: December 10, 2024
Patent Number:
12162796
A substrate processing system for processing of a plurality of substrates is described. The system includes a first deposition module being a first in-line module and having a first plurality of vacuum deposition sources; a second deposition module being a second in-line module and having a second plurality of vacuum deposition sources; and a glass handling module between the first deposition module and the second deposition module.
Chamber components with polished internal apertures
Granted: December 10, 2024
Patent Number:
12162115
Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 ?in.
Electrostatic chuck with porous plug
Granted: December 10, 2024
Patent Number:
12162111
Electrostatic chucks and method for forming the same are described herein. The electrostatic chucks include a backside gas passage having a ceramic porous plug secured therein by a ceramic body of the chuck with a ceramic-to-ceramic body. In one example, ceramic porous plug is sintered with the ceramic body.
Coated drug compositions and methods of preparing the same
Granted: December 10, 2024
Patent Number:
12161759
A pharmaceutical composition containing a metal oxide coated particle comprising 1) an amorphous solid dispersion (ASD) core containing an active pharmaceutical ingredient (API) and a polymer; and 2) a metal oxide coating, and the method of making said metal oxide coated particle by atomic layer deposition (ALD). The metal oxide coated particle is useful because it prevents the ASD from crystallization and helps maintain the ASD in an amorphous form.
Die system and method of comparing alignment vectors
Granted: December 3, 2024
Patent Number:
12159392
Embodiments of the present disclosure include a die system and a method of comparing alignment vectors. The die system includes a plurality of dies arranged in a desired pattern. An alignment vector, such as a die vector, can be determined from edge features of the die. The alignment vectors can be compared to other dies or die patterns in the same system. A method of comparing dies and die patterns includes comparing die vectors and/or pattern vectors. The comparison between alignment…
Ultraviolet and ozone clean system
Granted: December 3, 2024
Patent Number:
12159782
A cleaning apparatus for cleaning a substrate includes a lamp for emitting ultraviolet radiation in an irradiation region; a housing that houses the lamp; a water deflector spaced below the housing, the water deflector having a water inlet for receiving a supply of ozonated water and a water outlet for discharging ozonated water irradiated by the lamp into a substrate processing region beneath the water deflector, and defining a water flow path between the water inlet and the water…
