Identification of an array in a semiconductor specimen
Granted: April 15, 2025
Patent Number:
12277750
There is provided a method and a system configured obtain an image of a semiconductor specimen including one or more arrays, each including repetitive structural elements, and one or more regions, each region at least partially surrounding a corresponding array and including features different from the repetitive structural elements, wherein the PMC is configured to, during run-time scanning of the semiconductor specimen, perform a correlation analysis between pixel intensity of the…
HDLC data reception using signal pulse widths
Granted: April 15, 2025
Patent Number:
12278637
A system and method of receiving HDLC communications is disclosed. The system measures the pulse width of the incoming signal and converts each pulse into a series of bits, based on its pulse width. In this way, the reception of the HDLC communication is not dependent on any particular clock rate and is adaptable. The system takes advantages of the fact that the flag is a string of six consecutive bits that are all “1”. Thus, the longest positive pulse width may be used to determine…
Substrate frame design for three-dimensional stacked electronic assemblies and method for the same
Granted: April 15, 2025
Patent Number:
12278172
In order to relieve the stress on the substrates in a 3D stacked electronic assembly, a substrate frame is divided into a plurality of frame sections that are separated by spaces between the frame sections. These separations allow the substrates to expand/contract in response to temperature variations and other environmental conditions, and generally allow the substrates to move in one or more axial directions. The separations between the substrate portions are design-specific for each…
Servo-control system
Granted: April 15, 2025
Patent Number:
12278134
A lift apparatus includes a lift assembly and a servo-control system. The lift assembly includes at least one pneumatic actuator including a movable member to provide a load to transfer a substrate between a support and a transfer plane. The lift assembly further includes at least one proportional pneumatic valve to control fluid flow between the actuator and a pressurized fluid supply or a vent, a plurality of pressure sensors each to measure pressure in a respective supply line to the…
Auto fine-tuner for desired temperature profile
Granted: April 15, 2025
Patent Number:
12278127
Embodiments disclosed herein include a method of setting a target profile. In an embodiment, the method comprises obtaining a first gain curve for one or more temperature sensor offsets, and obtaining a second gain curve for one or more zone multipliers. In an embodiment, the method further comprises combining the first gain curve and the second gain curve into a thermal model. In an embodiment, the method further comprises obtaining a reference data set, and using the thermal model to…
Model-based controlled load lock pumping scheme
Granted: April 15, 2025
Patent Number:
12278124
A load lock in which the pumping speed is controlled so as to minimize the possibility of condensation is disclosed. The load lock is in communication with a vacuum pump and a valve. A controller is used to control the valve such that the supersaturation ratio within the load lock does not exceed a predetermined threshold, which is less than or equal to the critical value at which vapor condenses. In certain embodiments, a computer model is used to generate a profile, which may be a…
Bias voltage modulation approach for SiO/SiN layer alternating etch process
Granted: April 15, 2025
Patent Number:
12278110
Embodiments of the present disclosure generally relate to a method for etching a film stack with high selectivity and low etch recipe transition periods. In one embodiment, a method for etching a film stack having stacked pairs of oxide and nitride layers is described. The method includes transferring a substrate having a film stack formed thereon into a processing chamber, providing a first bias voltage to the substrate, etching an oxide layer of the film stack while providing the first…
Coded substrate material identifier communication tool
Granted: April 15, 2025
Patent Number:
12278101
Embodiments disclosed herein include methods of processing substrates in a tool. In an embodiment, the method of processing the substrate in the tool, comprises receiving an augmented recipe with a machine learning (ML) and/or an artificial intelligence (AI) module. In an embodiment, the augmented recipe comprises, a recipe for processing the substrate in the tool, and a matrix identifier that corresponds to one or more substrate properties. In an embodiment the method further comprises…
Plasma uniformity control system and methods
Granted: April 15, 2025
Patent Number:
12278089
Embodiments of the present disclosure include an apparatus and methods for the plasma processing of a substrate. Some embodiments are directed to a plasma processing chamber. The plasma processing chamber generally includes a planar coil region comprising a plurality of planar coils, a first power supply circuit coupled to at least two of the plurality of planar coils, a concentric coil region at least partially surrounding the planar coil region, and a second power supply circuit…
Hybrid scanning electron microscopy and acousto-optic based metrology
Granted: April 15, 2025
Patent Number:
12278085
Disclosed herein is a method for non-destructive hybrid acousto-optic and scanning electron microscopy-based metrology. The method includes: (i) obtaining acousto-optic and scanning electron microscopy measurement data of an inspected structure on a sample; (ii) processing the measurement data to extract values of key measurement parameters corresponding to the acousto-optic measurement data and the scanning electron microscopy measurement data, respectively; and (iii) obtaining…
System and method to map thickness variations of substrates in manufacturing systems
Granted: April 15, 2025
Patent Number:
12276490
Implementations disclosed describe, among other things, a system and a method of scanning a substrate with a beam of light and detecting for each of a set of locations of the substrate, a respective one of a set of intensity values associated with a beam of light reflected from (or transmitted through) the substrate. The detected intensity values are used to determine a profile of a thickness of the substrate.
Self-adjustable variable orifice check valve for back pressure reduction
Granted: April 15, 2025
Patent Number:
12276344
Variable orifice check valves comprising a flange with a guide pin, spring and movable plate are described. The flange has a body with at least one guide pin opening in the top surface. A guide pin is positioned within the at least one guide pin opening and a spring is positioned around the guide pin. The movable plate has an opening and slides along the guide pins with the spring between the top surface of the flange body and the bottom surface of the movable plate.
Method of dispensing paste for a printer using a paste dispensing apparatus and paste dispensing apparatus for dispensing paste for a printer
Granted: April 15, 2025
Patent Number:
12275232
A method of dispensing paste for a printer using a paste dispensing apparatus is provided. The paste dispensing apparatus includes a reservoir for storing a paste for a printer. The reservoir includes a stirrer for stirring the paste. The paste dispensing apparatus includes a receptacle for receiving paste from the reservoir. The paste dispensing apparatus includes a closable passage from the reservoir to the receptacle. The closable passage is changeable between an open state and a…
Gas distribution plate
Granted: April 15, 2025
Patent Number:
D1071103
Dual pressure oxidation method for forming an oxide layer in a feature
Granted: April 8, 2025
Patent Number:
12272531
A method and apparatus for growing an oxide layer within a feature of a substrate is described herein. The method is suitable for use in semiconductor manufacturing. The oxide layer is formed by exposing a substrate to both a high pressure oxidant exposure and a lower pressure oxygen containing plasma exposure. The high pressure oxidant exposure is performed at a pressure of greater than 10 Torr, while the lower pressure oxygen containing plasma exposure is performed at a pressure of…
Method of deposition on a substrate used for the manufacture of a solar cell, screen for screen printing on a substrate used for the manufacture of a solar cell, processing line for processing a substrate used for the manufacture of a solar cell
Granted: April 8, 2025
Patent Number:
12274101
A method of deposition on a substrate used for the manufacture of a solar cell is provided. The method includes depositing a first conductive pattern on a first side of the substrate. The first conductive pattern is one of a plurality of busbars and a plurality of fingers. The method includes providing a screen over the substrate. The screen includes a set of openings. The screen has a bottom side having a varying vertical profile including low portions and high portions. The method…
Electronic device manufacturing system
Granted: April 8, 2025
Patent Number:
12274007
An electronic device manufacturing system includes a mainframe including a transfer chamber and facets defining side walls of the transfer chamber. The facets include first facet, second facet, third facet, and fourth facet that form the transfer chamber. The first facet has a first number of substrate access ports. The second facet has a second number of substrate access ports. A first substrate access port of the first facet has a first side dimension and a second substrate access port…
Method of enhancing contrast while imaging high aspect ratio structures in electron microscopy
Granted: April 8, 2025
Patent Number:
12272607
The enclosed disclosure relates to a method and apparatus for depositing functionalized nanoparticles within a semiconductor structure in order to create a nano-layer capable of enhancing imaging and contrast, The semiconductor structure can include any type of VNAND structure or 3D structure, The nanoparticles are formed in high-aspect ratio trenches of the structure and form a nano-layer. The functionalized nanoparticles comprise synthesized nanoparticles as well as organic molecules.…
Metal oxide directional removal
Granted: April 8, 2025
Patent Number:
12272563
Exemplary etching methods may include modifying an exposed surface of a layer of metal oxide on a substrate housed in a processing region of a semiconductor processing chamber to produce a modified portion of metal oxide. The methods may include contacting the modified portion of metal oxide with a fluorine-containing precursor. The contacting may produce a metal oxy-fluoride material. The methods may include flowing an etchant precursor into the processing region. The methods may…
Selective metal removal with flowable polymer
Granted: April 8, 2025
Patent Number:
12272551
Embodiments of the disclosure relate to methods for selectively removing metal material from the top surface and sidewalls of a feature. The metal material which is covered by a flowable polymer material remains unaffected. In some embodiments, the metal material is formed by physical vapor deposition resulting in a relatively thin sidewall thickness. Any metal material remaining on the sidewall after removal of the metal material from the top surface may be etched by an additional etch…
