Residue measurement from machine learning based processing of substrate images
Granted: April 8, 2025
Patent Number:
12272047
A neural network is trained for use in a substrate residue classification system by obtaining ground truth residue level measurements of a top layer of a calibration substrate at a plurality of locations, each location at a defined position for a die being fabricated on the substrate. A plurality of color images of the calibration substrate are obtained, each color image corresponding to a region for a die being fabricated on the substrate. A neural network is trained to convert color…
Method of deposition on a substrate used for the manufacture of a solar cell, screen for screen printing on a substrate used for the manufacture of a solar cell, processing line for processing a substrate used for the manufacture of a solar cell
Granted: April 8, 2025
Patent Number:
12274101
A method of deposition on a substrate used for the manufacture of a solar cell is provided. The method includes depositing a first conductive pattern on a first side of the substrate. The first conductive pattern is one of a plurality of busbars and a plurality of fingers. The method includes providing a screen over the substrate. The screen includes a set of openings. The screen has a bottom side having a varying vertical profile including low portions and high portions. The method…
Electronic device manufacturing system
Granted: April 8, 2025
Patent Number:
12274007
An electronic device manufacturing system includes a mainframe including a transfer chamber and facets defining side walls of the transfer chamber. The facets include first facet, second facet, third facet, and fourth facet that form the transfer chamber. The first facet has a first number of substrate access ports. The second facet has a second number of substrate access ports. A first substrate access port of the first facet has a first side dimension and a second substrate access port…
Apparatus and method for contactless transportation of a carrier
Granted: April 8, 2025
Patent Number:
12273052
An apparatus for contactless transportation of a carrier is provided. The apparatus includes the carrier, being a substrate carrier or a mask carrier. The apparatus includes a linear reluctance motor for providing both a contactless levitation and a contactless drive of the carrier. The linear reluctance motor includes one or more linear stators defining a transportation track for the carrier. The linear reluctance motor includes a mover attached to the carrier. The linear reluctance…
Apparatus and method for contactless transportation of a carrier
Granted: April 8, 2025
Patent Number:
12273051
An apparatus for contactless transportation of a carrier is provided. The apparatus includes the carrier, being a substrate carrier or a mask carrier. The apparatus includes a linear reluctance motor for providing both a contactless levitation and a contactless drive of the carrier. The linear reluctance motor includes one or more linear stators defining a transportation track for the carrier. The linear reluctance motor includes a mover attached to the carrier. The linear reluctance…
Tin oxide and tin carbide materials for semiconductor patterning applications
Granted: April 8, 2025
Patent Number:
12272564
A method and apparatus for patterning semiconductor materials using tin-based materials as mandrels, hardmasks, and liner materials are provided. One or more implementations of the present disclosure use tin-oxide and/or tin-carbide materials as hardmask materials, mandrel materials, and/or liner material during various patterning applications. Tin-oxide or tin-carbide materials are easy to strip relative to other high selectivity materials like metal oxides (e.g., TiO2, ZrO2, HfO2,…
Metal oxide directional removal
Granted: April 8, 2025
Patent Number:
12272563
Exemplary etching methods may include modifying an exposed surface of a layer of metal oxide on a substrate housed in a processing region of a semiconductor processing chamber to produce a modified portion of metal oxide. The methods may include contacting the modified portion of metal oxide with a fluorine-containing precursor. The contacting may produce a metal oxy-fluoride material. The methods may include flowing an etchant precursor into the processing region. The methods may…
Selective metal removal with flowable polymer
Granted: April 8, 2025
Patent Number:
12272551
Embodiments of the disclosure relate to methods for selectively removing metal material from the top surface and sidewalls of a feature. The metal material which is covered by a flowable polymer material remains unaffected. In some embodiments, the metal material is formed by physical vapor deposition resulting in a relatively thin sidewall thickness. Any metal material remaining on the sidewall after removal of the metal material from the top surface may be etched by an additional etch…
Plasma sources and plasma processing apparatus thereof
Granted: April 8, 2025
Patent Number:
12272521
Embodiments of the present disclosure generally relate to inductively coupled plasma sources and plasma processing apparatus. In at least one embodiment, plasma source includes a first sidewall and a gas injection insert defining a plasma source interior volume. The gas injection insert includes a peripheral gas injection port, a second sidewall disposed concentric with the first sidewall, and a center gas injection port. The plasma source includes a first induction coil disposed…
3D metrology from 3D datacube created from stack of registered images obtained during delayering of the sample
Granted: April 8, 2025
Patent Number:
12272518
A method of evaluating a region of interest of a sample including: positioning the sample within in a vacuum chamber of an evaluation tool that includes a scanning electron microscope (SEM) column and a focused ion beam (FIB) column; acquiring a plurality of two-dimensional images of the region of interest by alternating a sequence of delayering the region of interest with a charged particle beam from the FIB column and imaging a surface of the region of interest with the SEM column;…
EPI self-heating sensor tube as in-situ growth rate sensor
Granted: April 8, 2025
Patent Number:
12270752
A method and apparatus for determining a growth rate on a semiconductor substrate is described herein. The apparatus is an optical sensor, such as an optical growth rate sensor. The optical sensor is positioned in an exhaust of a deposition chamber. The optical sensor is self-heated using one or more internal heating elements, such as a resistive heating element. The internal heating elements are configured to heat a sensor coupon. A film is formed on the sensor coupon by exhaust gases…
Deposition ring of a process kit for semiconductor substrate processing
Granted: April 8, 2025
Patent Number:
D1069863
Autonomous substrate processing system
Granted: April 1, 2025
Patent Number:
12265377
A cool cluster comprises one or more transfer chambers; a plurality of process chambers connected to the one or more transfer chambers; and a computing device of the tool cluster. The computing device is to receive first measurements generated by sensors of a first process chamber during or after a process is performed within the first process chamber; determine that the first process chamber is due for maintenance based on processing the first measurements using a first trained machine…
Film thickness uniformity improvement using edge ring and bias electrode geometry
Granted: April 1, 2025
Patent Number:
12266560
Embodiments of the present disclosure generally relate to the fabrication of integrated circuits and to apparatus for use within a substrate processing chamber to improve film thickness uniformity. More specifically, the embodiments of the disclosure relate to an edge ring. The edge ring may include an overhang ring.
Apparatus, system, and method for non-contact temperature monitoring of substrate supports
Granted: April 1, 2025
Patent Number:
12266551
Embodiments of the present disclosure relate to apparatus, systems and methods for substrate processing. A detachable substrate support is disposed within a processing volume of a processing chamber and the substrate support includes a substrate interfacing surface and a back surface. The pedestal hub has a supporting surface removably coupled to the substrate support. A hub volume of the pedestal hub includes temperature measuring assembly disposed therein positioned to receive…
Multiple process semiconductor processing system
Granted: April 1, 2025
Patent Number:
12266550
Exemplary substrate processing systems may include a plurality of processing regions. The systems may include a transfer region housing defining a transfer region fluidly coupled with the plurality of processing regions. The systems may include a plurality of substrate supports. Each substrate support of the plurality of substrate supports may be vertically translatable between the transfer region and an associated processing region of the plurality of processing regions. The systems may…
Selective barrier metal etching
Granted: April 1, 2025
Patent Number:
12266537
A method for selective barrier metal etching includes performing a hydrogen implantation process, in an inductively coupled plasma (ICP) etch chamber, to chemically reduce an oxidized portion of a barrier metal layer formed within a feature in a metal layer on the barrier metal layer, and performing an etch process, in the ICP etch chamber, to remove the hydrogen implanted portion of the barrier metal layer.
Scanning impedance measurement in a radio frequency plasma processing chamber
Granted: April 1, 2025
Patent Number:
12266506
Embodiments of the disclosure include a method of processing a substrate in a plasma processing system, comprising delivering an RF signal, by an RF generator, through an RF match to an electrode assembly disposed within the plasma processing system, wherein while delivering the RF signal the RF match is set to a first matching point, and delivering a voltage waveform, by a waveform generator, to the electrode assembly disposed within the plasma processing system while the RF signal is…
Matching process controllers for improved matching of process
Granted: April 1, 2025
Patent Number:
12265380
A method includes identifying first parameters of a first processing chamber of a semiconductor fabrication facility. The first parameters include first input parameters and first output parameters. The method further includes identifying second parameters of a second processing chamber of the semiconductor fabrication facility. The second parameters include second input parameters and second output parameters. The method further includes generating, by a processing device based on the…
Methods and mechanisms for adjusting film deposition parameters during substrate manufacturing
Granted: April 1, 2025
Patent Number:
12265379
An electronic device manufacturing system capable of obtaining metrology data associated with a deposition process performed on a substrate according to a process recipe, wherein the deposition process generates a plurality of layers on a surface of the substrate. The manufacturing system can further obtain an expected profile associate with the process recipe, wherein the expected profile comprises a plurality of values indicative of a desired thickness for a plurality of layers of the…
