Flexible cover lens films
Granted: October 1, 2024
Patent Number:
12108622
Flexible display devices, such as flexible cover lens films, are discussed and provided herein. The flexible cover lens film has good strength, elasticity, optical transmission, wear resistance, and thermostability. The cover lens film includes a hard coat layer with a thickness from about 5 ?m to 40 ?m, an impact absorption layer with a thickness from about 20 ?m to 110 ?m, and a substrate layer with a thickness from about 10 ?m to 175 ?m and is disposed between the hard coat layer and…
Vertical transistor fabrication for memory applications
Granted: October 1, 2024
Patent Number:
12108604
Embodiments of the present disclosure provide an apparatus and methods for forming stair-like structures with accurate profiles and dimension control for manufacturing three dimensional (3D) stacked memory cell semiconductor devices. In one embodiment, a memory cell device includes a film stack comprising alternating pairs of dielectric layers and conductive structures horizontally formed on a substrate, an opening formed in the film stack, wherein the opening is filled with a channel…
Substrate transfer systems and methods of use thereof
Granted: October 1, 2024
Patent Number:
12106991
Disclosed herein are systems and methods relating to a transfer chamber for an electronic device processing system. The transfer chamber includes a magnetic levitation platform, having a magnetic levitation track disposed along a length of the transfer chamber and configured to generate a magnetic field above the track. The transfer chamber also includes a magnetic levitation track disposed along a width of the transfer chamber such that a plane of this lateral track crosses a plane of…
Accelerating preventative maintenance recovery and recipe optimizing using machine-learning based algorithm
Granted: October 1, 2024
Patent Number:
12106984
A method for determining processing chamber conditions using sensor data and a machine learning model is provided. The method includes receiving, by a processing device, sensor data that include chamber data indicating a state of an environment of a processing chamber processing a substrate according to a set of process parameters of a current process. The sensor data further include spectral data indicating optical emission spectra (OES) measurements of a plasma disposed within the…
Steam-assisted single substrate cleaning process and apparatus
Granted: October 1, 2024
Patent Number:
12106976
The present disclosure relates to a method and apparatus for cleaning a substrate. The method includes rotating a substrate disposed on a substrate support and spraying a front side of the substrate using steam through a front side nozzle assembly. A back side of the substrate is sprayed using steam through a back side dispenser assembly. A heated chemical is dispensed over the front side of the substrate.
Selective silicon deposition
Granted: October 1, 2024
Patent Number:
12106972
Exemplary semiconductor processing methods may include providing a silicon-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be disposed within the processing region. The substrate may include one or more patterned features separated by exposed regions of the substrate. The methods may include providing a hydrogen-containing precursor to the processing region of the semiconductor processing chamber. The methods may include forming a plasma…
Distortion current mitigation in a radio frequency plasma processing chamber
Granted: October 1, 2024
Patent Number:
12106938
Embodiments provided herein generally include apparatus, plasma processing systems and methods for distortion current mitigation. An example plasma processing system includes a voltage source coupled to an input node, which is coupled to an electrode disposed within a processing chamber, wherein the voltage source is configured to generate a pulsed voltage signal at the input node; a signal generator having an output, wherein the RF signal generator is configured to deliver a first RF…
Electrostatic chucking process
Granted: September 24, 2024
Patent Number:
12100609
One or more embodiments described herein generally relate to methods for chucking and de-chucking a substrate to/from an electrostatic chuck used in a semiconductor processing system. Generally, in embodiments described herein, the method includes: (1) applying a first voltage from a direct current (DC) power source to an electrode disposed within a pedestal; (2) introducing process gases into a process chamber; (3) applying power from a radio frequency (RF) power source to a showerhead;…
OLED anode structures including amorphous transparent conducting oxides and OLED processing method comprising the same
Granted: September 24, 2024
Patent Number:
12101947
Exemplary methods of OLED device processing are described. The methods may include forming an anode on a substrate. Forming the anode may include forming a first metal oxide material on the substrate, forming a metal layer over the first metal oxide material, forming a protective barrier over the metal layer, and forming a second metal oxide material over the amorphous protection material. The protective barrier may be an amorphous protection material overlying the metal layer.
Apparatus for controlling lift pin movement
Granted: September 24, 2024
Patent Number:
12100614
Embodiments of the present disclosure generally relate to lift pins and to apparatus for controlling lift pin movement. In an embodiment, an apparatus for positioning a substrate in a chamber is provided. The apparatus includes a chamber component, a lift pin having a top surface for supporting the substrate and a lift pin shaft and a stopper. The apparatus further includes a compressible element positioned between the chamber component and the stopper, the compressible element further…
Porous plug bonding
Granted: September 24, 2024
Patent Number:
12097665
Embodiments described herein generally relate to porous plugs having sealing layers for use in substrate support pedestals and methods for forming the same. In one or more embodiments, the sealing layer can be formed in-situ by applying a fluoroelastomer composition to at least one of the porous plug and the walls of a cavity of an electrostatic chuck. The fluoroelastomer composition can be cured in-situ to form the sealing layer between the porous plug and the wall of the cavity. The…
Amorphous silicon-based scavenging and sealing EOT
Granted: September 24, 2024
Patent Number:
12100595
A sacrificial sealing layer is formed on a high-? metal gate (HKMG) stack to suppress oxidants, e.g., oxygen and water, from impacting the metal gate stack, thus preserving the device EOT. The method integrated processes that include forming an interfacial layer on the substrate; forming a high-? metal oxide layer on the interfacial layer, the high-? metal oxide layer comprising a dipole region adjacent to the interfacial layer, the dipole region; depositing a capping layer on the high-?…
Deposition ring for thin substrate handling via edge clamping
Granted: September 24, 2024
Patent Number:
12100579
Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes: a deposition ring including a first portion having an first inner ledge and a second portion having a second inner ledge, wherein in a first position, the first portion is spaced from the second portion, and wherein in a second position, the second portion is configured to engage the first portion so that the first inner ledge is aligned…
High conductance inner shield for process chamber
Granted: September 24, 2024
Patent Number:
12100577
Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes a tubular body having a central opening configured to surround a substrate support, wherein sidewalls of the tubular body do not include any through holes; and a top plate coupled to an upper end of the tubular body and substantially covering the central opening, wherein the top plate has a gas inlet and has a diameter that is greater than…
Metal oxide preclean chamber with improved selectivity and flow conductance
Granted: September 24, 2024
Patent Number:
12100576
Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes: a chamber liner having a tubular body with an upper portion and a lower portion; a confinement plate coupled to the lower portion of the chamber liner and extending radially inward from the chamber liner, wherein the confinement plate includes a plurality of slots; a shield ring disposed within the chamber liner and movable between the…
Adaptive settling time control for binary-weighted charge redistribution circuits
Granted: September 24, 2024
Patent Number:
12099569
A method and circuit for performing vector operations may include, for each sequentially performed operation, operating a switch that corresponds to a current bit-order. Operating the switch may cause a value corresponding to an output of the operation to be stored on a capacitor corresponding to the current bit-order. A time interval during which the switch is operated may be non-uniform with respect to time intervals for other switches, and the time interval may be based at least in…
Methods and apparatus for correcting lithography systems
Granted: September 24, 2024
Patent Number:
12099308
Aspects of the present disclosure relate to methods and apparatus for correcting lithography systems. In one implementation, a method of operating a lithography system includes directing first light beams toward a reflective surface of a first substrate using an optical module. The method includes directing the first light beams collected through at least an objective lens toward a camera, and taking a plurality of first images of the first light beams. The method includes directing…
Forming variable depth structures with laser ablation
Granted: September 24, 2024
Patent Number:
12099241
A method for forming a device structure is disclosed. The method of forming a device structure includes forming a variable-depth structure in a device material layer using a laser ablation. A plurality of device structures is formed in the variable-depth structure to define slanted device structures therein. The variable-depth structure and the slanted device structures are formed using an etch process.
Surface roughness and emissivity determination
Granted: September 24, 2024
Patent Number:
12098914
A system includes a radiation source configured to emit a radiation beam. The system further includes a first optical sensor configured to detect a first intensity of a first portion of the radiation beam reflected from a surface of an object. The system further includes a second optical sensor configured to detect a second intensity of a second portion of the radiation beam scattered by the surface of the object. The system further includes a processing device communicatively coupled to…
Methods of making nanopowders, nanoceramic materials and nanoceramic components
Granted: September 24, 2024
Patent Number:
12098107
Disclosed are methods of forming a chamber component for a process chamber. The methods may include filling a mold with nanoparticles or plasma spraying nanoparticles, where at least a portion of the nanoparticles include a core particle and a thin film coating over the core particle. The core particle and thin film are formed of, independently, a rare earth metal-containing oxide, a rare earth metal-containing fluoride, a rare earth metal-containing oxyfluoride, or combinations thereof.…
