Methods and mechanisms for adjusting process chamber parameters during substrate manufacturing
Granted: February 25, 2025
Patent Number:
12235624
An electronic device manufacturing system capable of obtaining metrology data generated using metrology equipment located within a process chamber that performs a deposition process on a substrate according to a process recipe, wherein the process recipe comprises a plurality of setting parameters, and wherein the deposition process generates a plurality of film layers on a surface of the substrate. The manufacturing system can further generate a correction profile based on the metrology…
Print process for color conversion layer using porous host or positive photoresist
Granted: February 25, 2025
Patent Number:
12237445
A method of fabricating a multi-color display includes forming a host matrix over a display having an array of light emitting diodes. The host matrix is sensitive to ultraviolet light. A first plurality of light emitting diodes in a first plurality of wells are activated to illuminate a portion of the host matrix to cause the portion of the host matrix to develop internal porous structures. A first photo-curable fluid including a first color conversion agent is dispensed. The first…
Plasma treatment on metal-oxide TFT
Granted: February 25, 2025
Patent Number:
12237406
Techniques are disclosed for methods of post-treating an etch stop or a passivation layer in a thin film transistor to increase the stability behavior of the thin film transistor.
Lift pin interface in a substrate support
Granted: February 25, 2025
Patent Number:
12237200
Methods and apparatus for lift pin interfaces for electrostatic chucks are provided herein. In some embodiments, a lift pin interface in an electrostatic chuck includes: a dielectric plate having a support surface for a substrate; a conductive plate disposed beneath the dielectric plate and having an opening formed therethrough, wherein the dielectric plate includes a protrusion extending into the opening in the conductive plate; and a lift pin guide disposed in the opening, wherein the…
Etch feedback for control of upstream process
Granted: February 25, 2025
Patent Number:
12237158
A substrate processing system comprises an etch chamber configured to perform an etch process on a substrate, the etch chamber comprising an optical sensor to generate one or more optical measurements of a film on the substrate during and/or after the etch process. The system further comprises a computing device operatively connected to the etch chamber, wherein the computing device is to: receive the one or more optical measurements of the film; determine, for each optical measurement…
Reducing aspect ratio dependent etch with direct current bias pulsing
Granted: February 25, 2025
Patent Number:
12237149
Embodiments of the present disclosure generally relate to a system used in a semiconductor device manufacturing process. More specifically, embodiments provided herein generally include apparatus and methods for synchronizing and controlling the delivery of an RF bias signal and a pulsed voltage waveform to one or more electrodes within a plasma processing chamber. The apparatus and methods disclosed herein can be useful to at least minimize or eliminate a microloading effect created…
Plasma processing assembly using pulsed-voltage and radio-frequency power
Granted: February 25, 2025
Patent Number:
12237148
Embodiments of the disclosure provided herein include an apparatus and method for the plasma processing of a substrate in a processing chamber. More specifically, embodiments of this disclosure describe a biasing scheme that is configured to provide a pulsed-voltage (PV) waveform delivered from one or more pulsed-voltage (PV) generators to the one or more electrodes within the processing chamber. The plasma process(es) disclosed herein can be used to control the shape of an ion energy…
Determining a depth of a hidden structural element background
Granted: February 25, 2025
Patent Number:
12237146
A method for determining a depth of a hidden structural element of an object, the method may include (i) obtaining contrast information regarding a contrast between (a) hidden structural element detection signals that are indicative of electrons emitted from the hidden structural element, and (b) surroundings detection signals that are indicative of electrons emitted from a surroundings of the hidden structural element; wherein the hidden structural element detection signals and the…
In-line metrology systems, apparatus, and methods for optical devices
Granted: February 25, 2025
Patent Number:
12236575
Embodiments of the present disclosure relate to optical devices for augmented, virtual, and/or mixed reality applications. In one or more embodiments, an optical device metrology system is configured to measure a plurality of first metrics and one or more second metrics for optical devices, the one or more second metrics including a display leakage metric.
Methods and mechanisms for generating virtual knobs for model performance tuning
Granted: February 25, 2025
Patent Number:
12236077
An electronic device manufacturing system configured to receive, by a processor, input data reflecting a feature related to a manufacturing process of a substrate. The manufacturing system is further configured to train a machine-learning model based on the input data reflecting the feature. The manufacturing system is further configured to modify the machine-learning model in view of the virtual knob for the feature.
Operations of robot apparatuses within rectangular mainframes
Granted: February 18, 2025
Patent Number:
12226896
A robot apparatus is configured to extend a first end effector into a first process chamber and extend a second end effector into a second process chamber. The first process chamber and the second process chamber are separated by a first pitch. The robot apparatus is further configured to retract the first end effector and the second end effector into a rectangular mainframe while maintaining a distance between the substrates bounded by the first pitch throughout a retraction process,…
Methods and apparatus for cooling a substrate support
Granted: February 18, 2025
Patent Number:
12232299
Methods and apparatus for processing a substrate are provided herein. For example, an apparatus for processing a substrate comprises a process chamber configured to process a substrate, a substrate support comprising a heat sink configured to cool the substrate support during operation and a water trap panel comprising a pumping ring configured to cool the water trap panel such that the water trap panel condenses water vapor molecules and drops a process chamber pressure during…
Three dimensional device formation using early removal of sacrificial heterostructure layer
Granted: February 18, 2025
Patent Number:
12230691
A method for forming a nanosheet device. The method may include providing a heterostructure device stack above a semiconductor substrate. The method may include patterning the heterostructure device stack to define a dummy gate region, and before forming a source drain recess adjacent the dummy gate region, selectively removing a first set of sacrificial layers of the heterostructure device stack within the dummy gate region.
Methods of post treating silicon nitride based dielectric films with high energy low dose plasma
Granted: February 18, 2025
Patent Number:
12230499
A method of post-treating a silicon nitride (SiN)-based dielectric film formed on a surface of a substrate includes positioning a substrate having a silicon nitride (SiN)-based dielectric film formed thereon in a processing chamber, and exposing the silicon nitride (SiN)-based dielectric film to helium-containing high-energy low-dose plasma in the processing chamber. Energy of helium ions in the helium-containing high-energy low-dose plasma is between 1 eV and 3.01 eV, and flux density…
Temperature-controlled surface with a cryo-nanomanipulator for improved deposition rate
Granted: February 18, 2025
Patent Number:
12230473
A method of depositing material over a sample in a deposition region of the sample with a charged particle beam column, the method comprising: positioning a sample within a vacuum chamber such that the deposition region is under a field of view of the charged particle beam column; cooling the deposition region by contacting the sample with a cyro-nanomanipulator tool in an area adjacent to the deposition region; injecting a deposition precursor gas into the vacuum chamber at a location…
In-line metrology systems, apparatus, and methods for optical devices
Granted: February 18, 2025
Patent Number:
12229940
Embodiments of the present disclosure relate to optical devices for augmented, virtual, and/or mixed reality applications. In one or more embodiments, an optical device metrology system is configured to measure a plurality of first metrics and one or more second metrics for optical devices, the one or more second metrics including a display leakage metric.
Eco-efficiency monitoring and exploration platform for semiconductor manufacturing
Granted: February 18, 2025
Patent Number:
12228905
Technologies directed to an eco-efficiency monitoring and exploration platform for semiconductor manufacturing. One method includes receiving, by a processing device, first data indicating an update to a substrate fabrication system having a first configuration of manufacturing equipment and operating to one or more process procedures. The method further includes determining, by the processing device, using the first data with a digital replica, environmental resource data. The digital…
Capacitive sensor for monitoring gas concentration
Granted: February 18, 2025
Patent Number:
12228534
Embodiments disclosed herein include gas concentration sensors, and methods of using such gas concentration sensors. In an embodiment, a gas concentration sensor comprises a first electrode. In an embodiment the first electrode comprises first fingers. In an embodiment, the gas concentration sensor further comprises a second electrode. In an embodiment, the second electrode comprises second fingers that are interdigitated with the first fingers.
Substrate position calibration for substrate supports in substrate processing systems
Granted: February 18, 2025
Patent Number:
12228395
Methods and apparatus for substrate position calibration for substrate supports in substrate processing systems are provided herein. In some embodiments, a method for positioning a substrate on a substrate support includes: obtaining a plurality of backside pressure values corresponding to a plurality of different substrate positions on a substrate support by repeatedly placing a substrate in a position on the substrate support, and vacuum chucking the substrate to the substrate support…
Level monitoring and active adjustment of a substrate support assembly
Granted: February 18, 2025
Patent Number:
12227847
Embodiments of the present disclosure generally relate to an apparatus and method of processing a substrate. In at least one embodiment, an apparatus includes a chamber body, a substrate support assembly and a bracket assembly disposed outside the chamber body and coupled to the substrate support assembly. The bracket assembly has a plurality of leveling screws for adjusting a level of the substrate support assembly. The apparatus includes an actuator coupled to one of the plurality of…
