METHODS AND APPARATUS FOR SEMICONDCUTOR DIE FAULT ANALYSIS USING MULTIPLE IMAGING TOOLS
Granted: January 16, 2025
Application Number:
20250022123
Methods and apparatus for semiconductor die fault analysis are disclosed. An example apparatus comprises interface circuitry, machine-readable instructions, and at least one processor circuit to be programmed by the machine-readable instructions to identify a location of a reference feature on a semiconductor die within a first image of the semiconductor die, the first image containing a region of interest on the semiconductor die adjacent to the reference feature, transform a baseline…
COOLING MASS AND SPRING ELEMENT FOR LOW INSERTION FORCE HOT SWAPPABLE ELECTRONIC COMPONENT INTERFACE
Granted: January 16, 2025
Application Number:
20250024647
An apparatus is described. The apparatus includes a cooling mass. The apparatus includes a cooling block having an opening to receive a portion of the cooling mass. The apparatus having a spring element to be rotated about an axis of rotation. An obstruction between a hot pluggable electronic component and an electro-mechanical connector is to be removed by the spring element's rotation. The cooling mass is to be pressed toward the hot pluggable electronic component in response to a…
PROTRUSIONS OF SOCKET BODIES HAVING METAL
Granted: January 16, 2025
Application Number:
20250024622
Protrusions of socket bodies having metal are disclosed. An example apparatus comprises a socket body, the socket body including a plastic material, an array of contacts distributed across a surface of the socket body, and a protrusion extending away from the surface of the socket body, the protrusion to facilitate alignment of an IC package with the array of contacts, the protrusion including metal.
APPARATUS, SYSTEM, AND METHOD OF SIGNALING SEGMENT-ASSOCIATION-INFORMATION (SAI) QUEUE-SIZE INFORMATION FOR COMMUNICATION OF APPLICATION LAYER PACKETS
Granted: January 16, 2025
Application Number:
20250024323
For example, an apparatus may include logic and circuitry configured to cause a non Access Point (AP) (non-AP) station (STA) to set one or more Segment-Association-Information (SAI) queue-size subfields in a control field. For example, the one or more SAI queue-size subfields may indicate queue sizes of one or more SAI queues at the non-AP STA. For example, an SAI queue of the one or more SAI queues may queue packet segments corresponding to a same application layer packet. For example,…
TECHNIQUES FOR VARIABLE CHANNEL BANDWIDTH SUPPORT
Granted: January 16, 2025
Application Number:
20250023608
Techniques for supporting variable channel bandwidths in a wireless communications network are described. In one embodiment, for example, an apparatus may comprise a processor circuit and a communications management module, and the communications management module may be operable by the processor circuit to determine a channel bandwidth for communication over a channel of a wireless network, transmit a beamforming initiation message comprising a channel bandwidth parameter indicating the…
APPARATUS, SYSTEM AND METHOD OF COMMUNICATING A SINGLE-USER (SU) MULTIPLE-INPUT-MULTIPLE-OUTPUT (MIMO) TRANSMISSION
Granted: January 16, 2025
Application Number:
20250023603
Some demonstrative embodiments include apparatuses, systems and/or methods of communicating a Single-User (SU) Multiple-Input-Multiple-Output (MIMO) transmission. For example, a first wireless communication station may be configured to transmit a Request to Send (RTS) to a second wireless communication station via a plurality of SU MIMO Transmit (Tx) sectors of the first wireless communication station, the RTS to establish a Transmit Opportunity (TXOP) to transmit an SU-MIMO transmission…
MICRO LIGHT EMITTING DIODE STRUCTURES FORMED IN A RECESS OF A TRANSPARENT SUBSTRATE
Granted: January 16, 2025
Application Number:
20250022908
Techniques and mechanisms for a micro-LED (or “uLED”) device to facilitate communication of an optical signal which is propagated via a transparent substrate structure. In an embodiment, one or more recess structures are formed in a side of a transparent substrate structure, such as a glass core of a package substrate. A uLED structure extends partially through the transparent substrate structure in a first recess structure, and is oriented to transmit or receive an optical signal…
USE OF A PLACEHOLDER FOR BACKSIDE CONTACT FORMATION FOR TRANSISTOR ARRANGEMENTS
Granted: January 16, 2025
Application Number:
20250022878
Methods for fabricating a transistor arrangement of an IC structure by using a placeholder for backside contact formation, as well as related semiconductor devices, are disclosed. An example method includes forming, in a support structure (e.g., a substrate, a chip, or a wafer), a dielectric placeholder for a backside contact as the first step in the method. A nanosheet superlattice is then grown laterally over the dielectric placeholder, and a stack of nanoribbons is formed based on the…
METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES
Granted: January 16, 2025
Application Number:
20250022786
Methods and apparatus for edge protected glass cores are disclosed herein. An example package substrate includes a first glass layer including a first surface, a second surface opposite the first surface, and first lateral surfaces extending between the first and second surfaces, the first glass layer having a first via extending between the first surface and the second surface; and a dielectric material in contact with the first surface of the first glass layer and in contact with the…
DATA TRANSFER OVER AN INTERCONNECT BETWEEN DIES OF A THREE-DIMENSIONAL DIE STACK
Granted: January 16, 2025
Application Number:
20250022527
An example integrated circuit disclosed herein includes a first die including first microbumps associated with a source-synchronous data interface of a three-dimensional (3D) die stack, a first one of the first microbumps in circuit with a clock output of the first die, a second one of the first microbumps in circuit with a data output of the first die, the clock output and the data output associated with a transmitter side of the source-synchronous data interface. The example integrated…
SYSTEMS, METHOD, AND APPARATUS FOR QUALITY AND CAPACITY-AWARE GROUPED QUERY ATTENTION
Granted: January 16, 2025
Application Number:
20250021819
Systems, apparatus, articles of manufacture, and methods for quality and capacity-aware grouped query attention are disclosed. To accomplish such groupings, example instructions cause a machine to create a plurality of groups of query heads present in a key value cache using an evolutionary algorithm based on at least two objectives, quantify an amount of error introduced by a first group of query heads in the plurality of groups of query heads, and retain the query heads of the first…
METHODS AND APPARATUS TO PREVENT ATTACKS ON SOFTWARE
Granted: January 16, 2025
Application Number:
20250021630
Systems, apparatus, articles of manufacture, and methods are disclosed to prevent attacks on software. An example non-transitory machine readable storage medium comprising instructions to cause programmable circuitry to at least: insert a plurality of code blocks into an input code; insert replacement manager instructions into the input code, the replacement manager instructions to, when executed: determine a subset of the plurality of code blocks; and insert the subset of the plurality…
METHODS AND APPARATUS TO ENABLE SECURE MULTI-COHERENT AND POOLED MEMORY IN AN EDGE NETWORK
Granted: January 16, 2025
Application Number:
20250021482
Disclosed examples include accessing a memory access command, the memory access command identifying a memory address; determining a remote node that provides access to the memory address in a pooled memory shared by multiple nodes; and causing tunneling of the memory access command to the remote node to service the memory access command.
METHODS, SYSTEMS, ARTICLES OF MANUFACTURE AND APPARATUS TO GENERATE DYNAMIC COMPUTING RESOURCE SCHEDULES
Granted: January 16, 2025
Application Number:
20250021381
Methods, systems, articles of manufacture and apparatus are disclosed to generate dynamic computing resource schedules. An example apparatus includes interface circuitry, machine-readable instructions, and at least one processor circuit to be programmed by the machine-readable instructions to determine a first schedule policy based on (a) an interval parameter and (b) an energy budget parameter, the first schedule policy to include a first instantiation window. The example instructions…
HYBRID MANUFACTURING FOR INTEGRATING PHOTONIC AND ELECTRONIC COMPONENTS
Granted: January 16, 2025
Application Number:
20250020873
Microelectronic assemblies fabricated using hybrid manufacturing for integrating photonic and electronic components, as well as related devices and methods, are disclosed herein. As used herein, “hybrid manufacturing” refers to fabricating a microelectronic assembly by bonding at least two IC structures fabricated using different manufacturers, materials, or manufacturing techniques. Before bonding, at least one IC structure may include photonic components such as optical waveguides,…
SYSTEMS AND METHODS FOR CONTROLLING FLEXIBLE DISPLAYS
Granted: January 9, 2025
Application Number:
20250013420
Systems and methods for controlling flexible displays are disclosed herein. An example apparatus includes interface circuitry; machine-readable instructions; and at least one processor circuit to at least one of instantiate or execute the machine-readable instructions to determine a distance of a user relative to a display screen based on outputs of a sensor, the sensor in communication with one or more of the at least one processor circuit; determine a curvature radius of the display…
MULTIMODAL LARGE LANGUAGE MODEL WITH AUDIO TRIGGER
Granted: January 9, 2025
Application Number:
20250014590
Systems and methods to trigger LLM inference based on the presences of relevant audio, such as a keyword or sound event of interest. A detection head receives acoustic embeddings from an audio encoder and determines whether the audio stream includes relevant sounds (e.g., a selected audio trigger). When the audio stream does not include relevant sounds, multimodal LLM inference is bypassed, thereby saving power and protecting privacy. When relevant sounds are detected in the audio stream…
TRUSTED LOCAL MEMORY MANAGEMENT IN A VIRTUALIZED GPU
Granted: January 9, 2025
Application Number:
20250013758
Embodiments are directed to trusted local memory management in a virtualized GPU. An embodiment of an apparatus includes one or more processors including a trusted execution environment (TEE); a GPU including a trusted agent; and a memory, the memory including GPU local memory, the trusted agent to ensure proper allocation/deallocation of the local memory and verify translations between graphics physical addresses (PAs) and PAs for the apparatus, wherein the local memory is partitioned…
LINK LAYER-PHY INTERFACE ADAPTER
Granted: January 9, 2025
Application Number:
20250013600
An adapter is provided that includes a first interface to couple to a particular device, where link layer data is to be communicated over the first interface, and a second interface to couple to a physical layer (PHY) device. The PHY device includes wires to implement a physical layer of a link, and the link couples the adapter to another adapter via the PHY device. The second interface includes a data channel to communicate the link layer data over the physical layer, and a sideband…
IN-SYSTEM VALIDATION OF INTERCONNECTS BY ERROR INJECTION AND MEASUREMENT
Granted: January 9, 2025
Application Number:
20250013546
Systems and devices can include an error injection register comprising error injection parameter information. The systems and devices can also include error injection logic circuit to read error injection parameter information from the error injection register, and inject an error into a flow control unit (Flit); and protocol stack circuitry to transmit the Flit comprising the error on a multilane link. The injected error can be detected by a receiver and used to test and characterize…
