Multi-spot scanning system and method
Granted: September 10, 2009
Application Number:
20090225399
A multi-spot scanning technique using a spot array having a predetermined gap between spots can advantageously provide scalability to a large number of spots as well as the elimination of cross-talk between channels. The multi-spot scanning technique can select a number of spots for the spot array (1D or 2D), determine a separation between the spots to minimize crosstalk, and perform a scan on a wafer using the spot array and a full field of view (FOV). Performing the scan includes…
SYSTEM FOR MEASURING A SAMPLE WITH A LAYER CONTAINING A PERIODIC DIFFRACTING STRUCTURE
Granted: July 30, 2009
Application Number:
20090190141
To measure the critical dimensions and other parameters of a one- or two-dimensional diffracting structure of a film, the calculation may be simplified by first performing a measurement of the thickness of the film, employing a film model that does not vary the critical dimension or parameters related to other characteristics of the structure. The thickness of the film may be estimated using the film model sufficiently accurately so that such estimate may be employed to simplify the…
Split field inspection system using small catadioptric objectives
Granted: July 16, 2009
Application Number:
20090180176
A system for inspecting a specimen is provided. The system includes an illumination subsystem configured to produce a plurality of channels of light energy, each channel of light energy produced having differing characteristics (type, wavelength, etc.) from at least one other channel of light energy. Optics are configured to receive the plurality of channels of light energy and combine them into a spatially separated combined light energy beam and direct it toward the specimen. A data…
MULTIPLE CHUCK SCANNING STAGE
Granted: June 18, 2009
Application Number:
20090153824
A substrate processing system and method are disclosed. The system may include a stage, first and second chucks mounted on the stage and at least one processing head proximate the stage. The stage and processing head are configured for relative movement for a sufficient distance for the processing head to process both the first and second test substrates. According to the substrate processing method first and second substrates may be disposed on chucks mounted to a stage. The stage and a…
Parametric Profiling Using Optical Spectroscopic Systems
Granted: May 28, 2009
Application Number:
20090135416
A gallery of seed profiles is constructed and the initial parameter values associated with the profiles are selected using manufacturing process knowledge of semiconductor devices. Manufacturing process knowledge may also be used to select the best seed profile and the best set of initial parameter values as the starting point of an optimization process whereby data associated with parameter values of the profile predicted by a model is compared to measured data in order to arrive at…
SYSTEMS, CIRCUITS AND METHODS FOR REDUCING THERMAL DAMAGE AND EXTENDING THE DETECTION RANGE OF AN INSPECTION SYSTEM
Granted: April 16, 2009
Application Number:
20090096505
Inspection systems, circuits, and methods are provided to enhance defect detection by reducing thermal damage to large particles by dynamically altering the incident laser beam power level supplied to the specimen during a surface inspection scan. In one embodiment, an inspection system includes an illumination subsystem for directing light to a specimen at a first power level, a detection subsystem for detecting light scattered from the specimen, and a power attenuator subsystem for…
METHODS AND SYSTEMS FOR LITHOGRAPHY PROCESS CONTROL
Granted: March 26, 2009
Application Number:
20090079974
Methods and systems for evaluating and controlling a lithography process are provided. For example, a method for reducing within wafer variation of a critical metric of a lithography process may include measuring at least one property of a resist disposed upon a wafer during the lithography process. A critical metric of a lithography process may include, but may not be limited to, a critical dimension of a feature formed during the lithography process. The method may also include…
Ultra-broadband UV microscope imaging system with wide range zoom capability
Granted: March 26, 2009
Application Number:
20090080065
An ultra-broadband ultraviolet (UV) catadioptric imaging microscope system with wide-range zoom capability. The microscope system, which comprises a catadioptric lens group and a zooming tube lens group, has high optical resolution in the deep UV wavelengths, continuously adjustable magnification, and a high numerical aperture. The system integrates microscope modules such as objectives, tube lenses and zoom optics to reduce the number of components, and to simplify the system…
SYSTEMS AND METHODS FOR CREATING PERSISTENT DATA FOR A WAFER AND FOR USING PERSISTENT DATA FOR INSPECTION-RELATED FUNCTIONS
Granted: March 26, 2009
Application Number:
20090080759
Various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions are provided. One system includes a set of processor nodes coupled to a detector of an inspection system. Each of the processor nodes is configured to receive a portion of image data generated by the detector during scanning of a wafer. The system also includes an array of storage media separately coupled to each of the processor nodes. The processor nodes are…
High Density In-Package Microelectronic Amplifier
Granted: March 12, 2009
Application Number:
20090067137
A sensor module having a package substrate, a sensor disposed within and electrically connected to the package substrate, an amplifier disposed within and electrically connected to the package substrate, and electrical traces within the package substrate for routing sensor signals from the sensor to the amplifier, and then from the amplifier to external electrical connectors on the package substrate.
OPTICAL WAVEGUIDE RADIATION CONTROL
Granted: March 12, 2009
Application Number:
20090067797
An integrated optical planar waveguide chip comprising materials and structures such as substrates, adhesives, capping materials, and waveguide structures which are absorbing at the wavelength of the working radiation.
Memory cell and page break inspection
Granted: March 12, 2009
Application Number:
20090067722
A method of inspecting an array having memory blocks with page breaks disposed between them. The memory array is imaged with a sensor at a magnification such that the memory block size is a whole integer pixel multiple within the sensor. This creates an array image that is divided into sections. Those sections that include at least a portion of the memory blocks are selected into a candidate image. Pixels of the image within a boundary distance of a horizontal single line of pixels are…
Memory cell and page break inspection
Granted: March 12, 2009
Application Number:
20090067703
A method of inspecting an array having memory blocks with page breaks disposed between them. The memory array is imaged with a sensor at a magnification such that the memory cell size is a whole integer pixel multiple within the sensor. This creates an array image that is divided into sections. Those sections that include at least a portion of the memory blocks are selected into a candidate image. Pixels of the image within a boundary distance of a horizontal single line of pixels are…
Non Contact Substrate Chuck
Granted: March 12, 2009
Application Number:
20090067114
A chuck for releasably retaining a substrate, where the chuck has a body with a substrate receiving surface disposed in an X-Y coordinate plane and adapted to receive the substrate. The body has gas pressure delivery channels and gas vacuum drawing channels, where the gas pressure delivery channels and gas vacuum drawing channels are mutually exclusive within the body. The substrate receiving surface has gas pressure delivery portions in communication with the gas pressure delivery…
PROCESS CONDITION MEASURING DEVICE
Granted: March 5, 2009
Application Number:
20090056441
An instrument for measuring a parameter comprises a substrate, a plurality of sensors carried by and distributed across a surface of the substrate that individually measure the parameter at different positions, an electronic processing component carried by the substrate surface, electrical conductors extending across the surface connected to the sensors and the electronic processing component, and a cover disposed over the sensors, electronic processing component and conductors. The…
Wafer Edge Inspection
Granted: March 5, 2009
Application Number:
20090059236
In one embodiment, a surface analyzer system comprises a radiation targeting assembly to target radiation onto an edge surface of a wafer, the radiation targeting assembly comprising a first expanded paraboloid or expanded ellipsoid reflector positioned adjacent the edge surface of the wafer, a reflected radiation collecting assembly that collects radiation reflected from the surface, a signal processing module to generate surface parameter data from the reflected radiation, and a defect…
APPARATUS AND METHODS FOR SCATTERING-BASED SEMICONDUCTOR INSPECTION AND METROLOGY
Granted: February 26, 2009
Application Number:
20090050823
Disclosed are apparatus and methods for inspecting or measuring one or more semiconductor targets. An incident beam is directed towards a first target as the first target substantially, continuously moves such that the incident beam remains directed at such first target during a first time period in which the first target substantially, continuously moves between a first position and a second position. An output beam scattered from the first target, in response to the incident beam being…
COMPUTER-IMPLEMENTED METHODS FOR DETERMINING IF ACTUAL DEFECTS ARE POTENTIALLY SYSTEMATIC DEFECTS OR POTENTIALLY RANDOM DEFECTS
Granted: February 26, 2009
Application Number:
20090055783
Various computer-implemented methods for determining if actual defects are potentially systematic defects or potentially random defects are provided. One computer-implemented method for determining if actual defects are potentially systematic defects or potentially random defects includes comparing a number of actual defects in a group to a number of randomly generated defects in a group. The actual defects are detected on a wafer. A portion of a design on the wafer proximate a location…
SYSTEMS, CIRCUITS AND METHODS FOR EXTENDING THE DETECTION RANGE OF AN INSPECTION SYSTEM BY AVOIDING DETECTOR SATURATION
Granted: February 12, 2009
Application Number:
20090040511
Inspection systems, circuits and methods are provided to enhance defect detection by addressing anode saturation as a limiting factor of the measurement detection range of a photomultiplier tube (PMT) detector. In accordance with one embodiment of the invention, a method for inspecting a specimen includes directing light to the specimen and detecting light scattered from the specimen. The step of detecting may include monitoring an anode current of the PMT detector, and detecting…
Method and apparatus for scanning, stitching and damping measurements of a double sided metrology inspection tool
Granted: February 12, 2009
Application Number:
20090040514
A system for inspecting specimens such as semiconductor wafers is provided. The system provides scanning of dual-sided specimens using a damping arrangement which filters unwanted acoustic and seismic vibration, including an optics arrangement which scans a first portion of the specimen and a translation or rotation arrangement for translating or rotating the specimen to a position where the optics arrangement can scan the remaining portion(s) of the specimen. The system further includes…
