Reverse VT-state operation and optimized BiCS device structure
Granted: September 27, 2022
Patent Number:
11456044
Systems and methods for improving the reliability of non-volatile memory by reducing the number of memory cell transistors that experience excessive hole injection are described. The excessive hole injection may occur when the threshold voltage for a memory cell transistor is being set below a particular negative threshold voltage. To reduce the number of memory cell transistors with threshold voltages less than the particular negative threshold voltage, the programmed data states of the…
Multi-level program pulse for programming single level memory cells to reduce damage
Granted: September 27, 2022
Patent Number:
11456042
Apparatuses and techniques are described for reducing damage to memory cells during single bit per cell programming. An initial program pulse in a single bit per cell program operation has a lower, first program level followed by a higher, second program level. As a result of the lower, first program level, the electric field across the memory cells is reduced. The step up time from the first program level to the second program level can be reduced by concurrently stepping up pass…
High voltage field effect transistor with vertical current paths and method of making the same
Granted: September 20, 2022
Patent Number:
11450768
A field effect transistor for a high voltage operation can include vertical current paths, which may include vertical surface regions of a pedestal semiconductor portion that protrudes above a base semiconductor portion. The pedestal semiconductor portion can be formed by etching a semiconductor material layer employing a gate structure as an etch mask. A dielectric gate spacer can be formed on sidewalls of the pedestal semiconductor portion. A source region and a drain region may be…
Multibit ferroelectric memory cells and methods for forming the same
Granted: September 20, 2022
Patent Number:
11450687
A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers and memory stack structures vertically extending through the alternating stack. Each of the memory stack structures includes a vertical semiconductor channel and a vertical stack of ferroelectric memory elements surrounding the vertical semiconductor channel and located at levels of the electrically conductive layers. Each of the ferroelectric memory elements includes a…
Three-dimensional memory device containing bridges for enhanced structural support and methods of forming the same
Granted: September 20, 2022
Patent Number:
11450685
A three-dimensional memory device includes a first word-line region including a first alternating stack of first word lines and continuous insulating layers, first memory stack structures vertically extending through the first alternating stack, a second word-line region comprising a second alternating stack of second word lines and the continuous insulating layers, second memory stack structures vertically extending through the second alternating stack, plural dielectric separator…
Three-dimensional memory device including stairless word line contact structures for and method of making the same
Granted: September 20, 2022
Patent Number:
11450679
An alternating stack of insulating layers and sacrificial material layers is formed over a substrate. Memory openings and support openings are formed through the alternating stack, and memory opening fill structures and support pillar structures are formed in the memory openings and in the support openings, respectively. Via cavities extending to each of the sacrificial material layers are formed through the alternating stack without forming any stepped surfaces in the alternating stack.…
Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the same
Granted: September 20, 2022
Patent Number:
11450624
Semiconductor devices can be formed over a semiconductor substrate, and interconnect-level dielectric material layers embedding metal interconnect structures can be formed thereupon. In one embodiment, a pad-connection-via-level dielectric material layer, a proximal dielectric diffusion barrier layer, and a pad-level dielectric material layer can be formed. Bonding pads surrounded by dielectric diffusion barrier portions can be formed in the pad-level dielectric material layer. In…
Countermeasures for periodic over programming for non-volatile memory
Granted: September 20, 2022
Patent Number:
11450393
A non-volatile memory apparatus and method of operation are provided. The apparatus includes storage elements connected to a word line. Each of the storage elements is configured to be programmed to a respective target data state. The apparatus also includes a respective bit line associated with each of the storage elements and a control circuit configured to apply a plurality of program pulses to the word line that progressively increase by a program step voltage. The control circuit…
Memory scaling semiconductor device
Granted: September 13, 2022
Patent Number:
11444062
A semiconductor device is disclosed including a memory module formed from a pair of semiconductor dies mounted face to face to each other at the wafer level. These die pairs are formed using wafer-to-wafer bonding technology, where the wafers may be bonded to each other when they are of full thickness. Once bonded, respective inactive surfaces of the wafers may be thinned and then the die pairs diced from the wafers to form a completed memory module. When the wafers are bonded face to…
Spacerless source contact layer replacement process and three-dimensional memory device formed by the process
Granted: September 13, 2022
Patent Number:
11444101
A lower source-level dielectric etch-stop layer, a source-level sacrificial layer, and an upper source-level dielectric etch-stop layer are formed over a substrate. An alternating stack of insulating layers and sacrificial material layers is formed thereabove. Memory stack structures are formed through the alternating stack. Backside openings are formed through the alternating stack and into the in-process source-level material layers such that tapered surfaces are formed through the…
Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the same
Granted: September 13, 2022
Patent Number:
11444039
Semiconductor devices can be formed over a semiconductor substrate, and interconnect-level dielectric material layers embedding metal interconnect structures can be formed thereupon. In one embodiment, a pad-connection-via-level dielectric material layer, a proximal dielectric diffusion barrier layer, and a pad-level dielectric material layer can be formed. Bonding pads surrounded by dielectric diffusion barrier portions can be formed in the pad-level dielectric material layer. In…
Non-volatile memory with capacitors using metal under signal line or above a device capacitor
Granted: September 13, 2022
Patent Number:
11444016
A non-volatile storage apparatus comprises a non-volatile memory structure and a plurality of I/O pads in communication with the non-volatile memory structure. The I/O pads include a power I/O pad, a ground I/O pad and data/control I/O pads. The non-volatile storage apparatus further comprises one or more capacitors connected to the power I/O pad and the ground I/O pad. The one or more capacitors are positioned in one or more metal interconnect layers below the signal lines and/or above…
Three-dimensional memory device containing word lines formed by selective tungsten growth on nucleation controlling surfaces and methods of manufacturing the same
Granted: September 6, 2022
Patent Number:
11437270
A method of forming a memory device includes forming an alternating stack of insulating layers and sacrificial material layers over a substrate forming memory stack structures through the alternating stack, forming a first backside trench and a second backside trench through the alternating stack, forming backside recesses by removing the sacrificial material layers, depositing a backside blocking dielectric layer after formation of the backside recesses, forming a liner that a lesser…
Erase tail comparator scheme
Granted: September 6, 2022
Patent Number:
11437110
A method of performing an erase operation on non-volatile storage is disclosed. The method comprises: applying, in a first erase loop of a plurality of erase loops of the erase operation, a first erase pulse to a first grouping of non-volatile storage elements; after applying the first erase pulse, determining an upper tail of a threshold voltage distribution of the first grouping of non-volatile storage elements; determining a difference between the upper tail of the first grouping of…
Reduced verify scheme during programming based on spacing between verify levels
Granted: May 10, 2022
Patent Number:
11328780
Apparatuses and techniques are described for optimizing a program operation in a memory device in which groups of memory cells are programmed from checkpoint states to respective data states. In a first program pass, groups of memory cells are programmed to respective checkpoint states with verify tests. Each checkpoint state is associated with a set of data states. In a second program pass, the memory cells are programmed closer to their assigned data state with a specified number of…
Signal preserve in MRAM during reading
Granted: May 10, 2022
Patent Number:
11328759
Apparatuses and techniques are described for reading MRAM memory cells. In a cross-point memory array, each conductive line, such as a bit line or word line, is connected to a transistor pair comprising a pMOSFET in parallel with an nMOSFET. When selecting a memory cell to be read, a voltage of a first conductive line may be pulled up using the pMOSFET while a voltage of a second conductive line is pulled down, e.g., to 0 V, using the nMOSFET. This minimizes a capacitance while the…
Realization of binary neural networks in NAND memory arrays
Granted: May 10, 2022
Patent Number:
11328204
Use of a NAND array architecture to realize a binary neural network (BNN) allows for matrix multiplication and accumulation to be performed within the memory array. A unit synapse for storing a weight of a BNN is stored in a pair of series connected memory cells. A binary input is applied as a pattern of voltage values on a pair of word lines connected to the unit synapse to perform the multiplication of the input with the weight by determining whether or not the unit synapse conducts.…
Enhanced multistate verify techniques in a memory device
Granted: May 3, 2022
Patent Number:
11322213
A method comprises determining a verify voltage for a next iteration of a verify operation to be performed on memory cells a first set of memory cells of a selected word line, and determining data states for a second set of memory cells of at least one neighboring word line. The method further comprises determining, based on the data states, a verify voltage configuration that includes bit line voltage biases or sense times, and performing the next iteration of the verify operation on…
Semiconductor die containing dummy metallic pads and methods of forming the same
Granted: May 3, 2022
Patent Number:
11322466
A first semiconductor die includes first semiconductor devices located over a first substrate, first interconnect-level dielectric layers embedding first metal interconnect structures and located over the first semiconductor devices, a first pad-level dielectric layer embedding first bonding pads and located over the first interconnect-level dielectric layers, and first edge seal structures laterally surrounding the first semiconductor devices. Each of the first edge seal structures…
Three-dimensional memory device with dielectric wall support structures and method of forming the same
Granted: May 3, 2022
Patent Number:
11322440
A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive layers located between line trenches, a first memory array region and a second memory array region, and a pair of dielectric wall structures located between the first line trench and the second line trench and between the memory array regions. Each layer within the alternating stack continuously extends between the first memory array region and the second memory array region…
