Synopsys Patent Applications

METHOD FOR SUPPRESSING LAYOUT SENSITIVITY OF THRESHOLD VOLTAGE IN A TRANSISTOR ARRAY

Granted: December 4, 2008
Application Number: 20080296698
A method for smoothing variations in threshold voltage in an integrated circuit layout. The method begins by identifying recombination surfaces associated with transistors in the layout. Such recombination surfaces are treated to affect the recombination of interstitial atoms adjacent such surfaces, thus minimizing variations in threshold voltage of transistors within the layout

METHOD FOR COMPENSATION OF PROCESS-INDUCED PERFORMANCE VARIATION IN A MOSFET INTEGRATED CIRCUIT

Granted: December 4, 2008
Application Number: 20080297237
An automated method for compensating for process-induced variations in threshold voltage and drive current in a MOSFET integrated circuit. The method's first step is selecting a transistor for analysis from the array. The method loops among the transistors of the array as desired. Next the design of the selected transistor is analyzed, including the steps of determining threshold voltage variations induced by layout neighborhood; determining drive current variations induced by layout…

Dynamically Reconfigurable Shared Scan-In Test Architecture

Granted: December 4, 2008
Application Number: 20080301510
A low overhead dynamically reconfigurable shared scan-in test architecture is provided. This test architecture advantageously allows for changing scan inputs during the scan operation on a per shift basis. The flexibility of reconfiguring the scan input to scan chain mapping every shift cycle can advantageously reduce both test data volume and test application time.

METHOD FOR RAPID ESTIMATION OF LAYOUT-DEPENDENT THRESHOLD VOLTAGE VARIATION IN A MOSFET ARRAY

Granted: December 4, 2008
Application Number: 20080301599
An automated method for estimating layout-induced variations in threshold voltage in an integrated circuit layout. The method begins with the steps of selecting a diffusion area within the layout for analysis. Then, the system identifies Si/STI edges on the selected area as well as channel areas and their associated gate/Si edges. Next, the threshold voltage variations in each identified channel area are identified, which requires further steps of calculating threshold voltage variations…

METHOD AND APPARATUS FOR PERFORMING FORMAL VERIFICATION USING DATA-FLOW GRAPHS

Granted: December 4, 2008
Application Number: 20080301602
An equivalency testing system, for formally comparing an RTLM and HLM, is presented. RTLM and HLM are first converted into DFGs RTLMDFG and HLMDFG. RTLMDFG and HLMDFG are then put into timestep form and are called RTLMts and HLMts. A test bench CSts is selected that couples RTLMts and HLMts. The combination of RTLMts[t], HLMts[t] and CSts[t] can have parts designated as datapath. Parts designated as datapath can be subject to a form of equivalence checking that seeks to prove equivalence…

Lithography Suspect Spot Location and Scoring System

Granted: December 4, 2008
Application Number: 20080301623
A fast method to detect hot spots using foundry independent models that do not require RET/OPC synthesis is presented. In some embodiments of the present invention, sensitive spots are located. Lithography models are used to simulate the geometry near the sensitive spots to produce a model of the area around the sensitive spots. The sensitive spots are scored using a measure such as intensity (of light) or scoring based on contrast.

Stress-Enhanced Performance Of A FinFet Using Surface/Channel Orientations And Strained Capping Layers

Granted: December 4, 2008
Application Number: 20080296632
Different approaches for FinFET performance enhancement based on surface/channel direction and type of strained capping layer are provided. In one relatively simple and inexpensive approach providing a performance boost, a single surface/channel direction orientation and a single strained capping layer can be used for both n-channel FinFETs (nFinFETs) and p-channel FinFETs (pFinFETs). In another approach including more process steps (thereby increasing manufacturing cost) but providing a…

Integrated Circuit On Corrugated Substrate

Granted: November 27, 2008
Application Number: 20080290470
By forming MOSFETs on a substrate having pre-existing ridges of semiconductor material (i.e., a “corrugated substrate”), the resolution limitations associated with conventional semiconductor manufacturing processes can be overcome, and high-performance, low-power transistors can be reliably and repeatably produced. Forming a corrugated substrate prior to actual device formation allows the ridges on the corrugated substrate to be created using high precision techniques that are not…

Dynamically Reconfigurable Shared Scan-In Test Architecture

Granted: November 27, 2008
Application Number: 20080294955
A low overhead dynamically reconfigurable shared scan-in test architecture is provided. This test architecture advantageously allows for changing scan inputs during the scan operation on a per shift basis. The flexibility of reconfiguring the scan input to scan chain mapping every shift cycle can advantageously reduce both test data volume and test application time.

Characterizing Sequential Cells Using Interdependent Setup And Hold Times, And Utilizing The Sequential Cell Characterizations In Static Timing Analysis

Granted: November 27, 2008
Application Number: 20080295053
A sequential cell is characterized using interdependent setup/hold time pairs to produce associated clock-to-Q delay values, and then identifying setup/hold time pairs that produce a selected clock-to-Q delay value (e.g., 10% of failure). The identified setup/hold time pairs (or a piecewise linear (PWL) approximation thereof) are then stored in a cell library for use in static timing analysis (STA). During STA, the setup and hold skews calculated for each synchronous circuit are compared…

Full Phase Shifting Mask In Damascene Process

Granted: November 20, 2008
Application Number: 20080286664
A full phase shifting mask (FPSM) can be advantageously used in a damascene process for hard-to-etch metal layers. Because the FPSM can be used with a positive photoresist, features on an original layout can be replaced with shifters on a FPSM layout. Adjacent shifters should be of opposite phase, e.g. 0 and 180 degrees. In one embodiment, a dark field trim mask can be used with the FPSM. The trim mask can include cuts that correspond to cuts on the FPSM. Cuts on the FPSM can be made to…

Method Of Enforcing A Contract For A CAD Tool

Granted: November 20, 2008
Application Number: 20080288897
A method for enforcing a contract for a computer-aided-design (CAD) tool is provided. In this method, a first payment for the CAD tool is made in accordance with the contract. The first payment is associated with user access to the CAD tool. At this point, the CAD tool can be used, wherein the computer system running the CAD tool includes criteria for requesting at least one additional payment for the CAD tool. Each additional payment is associated with generating an output. The computer…

Segmentation And Interpolation Of Current Waveforms

Granted: November 20, 2008
Application Number: 20080288223
A method for generating a linear piecewise representation of a driver output current signal includes segmenting the driver output current signal such that an integral of each segment matches an actual voltage change in corresponding portion of an associated output voltage signal (within a desired tolerance). The beginning and ending current/time values for each segment can then be compiled into the piecewise linear representation of the driver output current signal. A method for…

Leakage Power Management with NDR Isolation Devices

Granted: November 13, 2008
Application Number: 20080278191
A method and system for minimizing sub-threshold leakage in a logic block is disclosed. An NDR isolation device is coupled between the logic block and ground to form a virtual ground node. To put the logic block into sleep mode, the virtual ground control device raises the voltage at the virtual ground node above an isolation voltage, which causes NDR isolation device isolates the virtual ground node from ground. The virtual ground control device can then raise the voltage at the virtual…

Patterning A Single Integrated Circuit Layer Using Multiple Masks And Multiple Masking Layers

Granted: November 13, 2008
Application Number: 20080280217
A multiple mask and a multiple masking layer technique can be used to pattern a single IC layer. A resolution enhancement technique can be used to define one or more fine-line patterns in a first masking layer, wherein each fine-line feature is sub-wavelength. Moreover, the pitch of each fine-line pattern is less than or equal to that wavelength. The portions of the fine-line features not needed to implement the circuit design are then removed or designated for removal using a mask.…

System And Method Of Providing Mask Defect Printability Analysis

Granted: October 23, 2008
Application Number: 20080260235
A simulated wafer image of a physical mask and a defect-free reference image are used to generate a severity score for each defect, thereby giving a customer meaningful information to accurately assess the consequences of using a mask or repairing that mask. The defect severity score is calculated based on a number of factors relating to the changes in critical dimensions of the neighbor features to the defect. A common process window can also be used to provide objective information…

Pipeline of additional storage elements to shift input/output data of combinational scan compression circuit

Granted: October 16, 2008
Application Number: 20080256274
An electronic device includes a scan-based circuit that includes a combinational decompressor, a combinational compressor, scan chains, and logic which typically includes a number of storage elements. Cycle time normally needed to shift data into or out of a scan cell to/from an external interface of the electronic device is reduced by use of one or more additional storage element(s) located between the external interface and one of the combinational elements (decompressor/compressor).…

Scan compression circuit and method of design therefor

Granted: October 16, 2008
Application Number: 20080256497
A scan-based circuit includes a selector that is implemented by multiple observation logics. Each observation logic is coupled to a scan chain to receive data to be supplied to a combinational compressor. Each observation logic is also coupled to a single input line in a corresponding group of input lines of the combinational compressor, to selectively supply data from the coupled scan chain. Each observation logic may be coupled to additional input lines (if present) in the…

Detailed Placer For Optimizing High Density Cell Placement In A Linear Runtime

Granted: October 9, 2008
Application Number: 20080250375
A detailed placement process which optimizes cell placement with up to one hundred percent densities in a linear run time. The output from a conjugate-gradient coarse placement process is input to the detailed placement process. A dynamic programming technique is used to optimize cell placement by swapping cells between two or more rows. The search space is pruned beforehand. A greedy cleanup phase using an incremental row placer is used. Thereby, the detailed placement process handles…

Determining a design attribute by estimation and by calibration of estimated value

Granted: October 2, 2008
Application Number: 20080243414
A computer-implemented method of determining an attribute of a circuit includes using a computationally expensive technique to simulate the attribute (such as timing delay or slew) of a portion of the circuit, at predetermined values of various parameters (e.g. nominal values of channel length or metal width), to obtain at least a first value of the attribute. The method also uses a computationally inexpensive technique to estimate the same attribute, thereby to obtain at least a second…