Dual-sided substrate measurement apparatus and methods
Granted: March 8, 2011
Patent Number:
7902040
An apparatus for measuring the relative positions of frontside and backside alignment marks located on opposite sides of a substrate is disclosed. The apparatus includes upper and lower optical systems that allow for simultaneous imaging of frontside and backside alignment marks. The frontside and backside alignment mark images are processed to determine the relative position of the marks, as a measurement of the alignment and/or overlay performance of the tool that formed the marks on…
Laser thermal annealing of lightly doped silicon substrates
Granted: February 1, 2011
Patent Number:
7879741
Apparatus and method for performing laser thermal annealing (LTA) of a substrate using an annealing radiation beam that is not substantially absorbed in the substrate at room temperature. The method takes advantage of the fact that the absorption of long wavelength radiation (1 micron or greater) in some substrates, such as undoped silicon substrates, is a strong function of temperature. The method includes heating the substrate to a critical temperature where the absorption of…
Method and apparatus for modifying an intensity profile of a coherent photonic beam
Granted: December 7, 2010
Patent Number:
7847213
A coherent beam source, e.g., a laser having a cavity that is unstable in at least one direction, is used to produce a coherent beam having an initial intensity profile. The beam is passed through a relay having a Fourier plane containing a spatial filter that serves as a radiation defining mask. The filter has an aperture size and shape effective to modify the beam such that the modified beam forms an image on a substrate. The to image has an intensity profile that more closely…
Methods and apparatus for remote temperature measurement of a specular surface
Granted: August 3, 2010
Patent Number:
7767927
Methods and apparatus for remotely measuring temperature of a specular surface. Method takes two measurements of P-polarized radiation emitted at or near Brewster angle from the surface. First measurement (SA) collects and detects first amount of radiation emitted directly from a surface portion using a collection optical system. Second measurement (SB) includes first amount of radiation and adds quantity of radiation collected at or near at/near Brewster angle and reflected from the…
Laser thermal processing with laser diode radiation
Granted: July 27, 2010
Patent Number:
7763828
A method and apparatus for performing laser thermal processing (LTP) using a two-dimensional array of laser diodes to form a line image, which is scanned across a substrate. The apparatus includes a two-dimensional array of laser diodes, the radiation from which is collimated in one plane using a cylindrical lens array, and imaged onto the substrate as a line image using an anomorphic, telecentric optical imaging system. The apparatus also includes a scanning substrate stage for…
Substrate-alignment using detector of substrate material
Granted: July 6, 2010
Patent Number:
7751067
Methods and apparatuses are provided for positioning a substrate having a target that may be located on either the front-side or the backside of the substrate. The optical detector that views the target contains a signal-generating material that is substantially identical to the substrate material.
Methods and apparatus for temperature measurement and control on a remote substrate surface
Granted: June 29, 2010
Patent Number:
7744274
Provided is an apparatus for substrate processing. The apparatus may include a radiation source emitting a photonic beam, an optical system to form a beam image, a scanning stage, a temperature monitoring means, an output signal generator that compares the monitored temperature with a preset temperature, and a controller coupled to the radiation source and the stage. The stage may be adapted to scan the substrate so the beam image heats a region of the substrate surface, and the…
Heated chuck for laser thermal processing
Granted: June 8, 2010
Patent Number:
7731798
A chuck for supporting a wafer and maintaining a constant background temperature across the wafer during laser thermal processing (LTP) is disclosed. The chuck includes a heat sink and a thermal mass in the form of a heater module. The heater module is in thermal communication with the heat sink, but is physically separated therefrom by a thermal insulator layer. The thermal insulator maintains a substantially constant power loss at least equal to the maximum power delivered by the…
Methods of forming a denuded zone in a semiconductor wafer using rapid laser annealing
Granted: June 8, 2010
Patent Number:
7732353
Methods for forming a denuded zone in an oxygen-containing semiconductor wafer using rapid laser annealing (RLA) are disclosed. The method includes scanning an intense beam of laser radiation over the surface of the wafer to raise the temperature of each point on the wafer surface to be at or near the wafer's melting temperature for a time period on the order of a millisecond or so. This rapid heating and cooling causes oxygen in the wafer near the wafer surface to diffuse out from the…
Method of beach renourishment using sand-entrapping wattles
Granted: March 9, 2010
Patent Number:
7674071
A method of using beach wattles formed of straw or like material to replenish and renourish a beach area or to create or replace sand dunes removed by storm erosion or the like, the method comprising the steps of placing wattles to entrap sand to build up a replenished mound, then positioning additional wattles on top of the replenished mound to create a higher mound, and repeating these steps as necessary until a mound or dune of desired bulk and height is created. The wattles entrap…
Computer architecture for and method of high-resolution imaging using a low-resolution image transducer
Granted: March 2, 2010
Patent Number:
7671966
Parallel data bus architecture, lithography system and method for substrate patterning with a high-resolution image by data generation transferring, display or printing high edge placement accuracy images from multiple exposures of plurality of predefined patterns with lower edge placement accuracy. Data bus architecture includes n predetermined patterns in n memory arrays each storing a low resolution pattern to be formed onto microelement array with a data bus connecting memory arrays…
Method and system for laser thermal processing of semiconductor devices
Granted: November 3, 2009
Patent Number:
7612372
Methods and systems for performing laser thermal processing (LTP) of semiconductor devices are disclosed. The method includes forming a dielectric cap atop a temperature-sensitive element, and then forming an absorber layer atop the dielectric layer. A switch layer may optionally be formed atop the absorber layer. The dielectric cap thermally isolates the temperature-sensitive element from the absorber layer. This allows less-temperature-sensitive regions such as unactivated source and…
Animal leash
Granted: June 16, 2009
Patent Number:
D594605
Dual-sided substrate measurement apparatus and methods
Granted: May 5, 2009
Patent Number:
7528937
An apparatus for measuring the relative positions of frontside and backside alignment marks located on opposite sides of a substrate is disclosed. The apparatus includes upper and lower optical systems that allow for simultaneous imaging of frontside and backside alignment marks. The frontside and backside alignment mark images are processed to determine the relative position of the marks, as a measurement of the alignment and/or overlay performance of the tool that formed the marks on…
Apparatus and methods for improving the intensity profile of a beam image used to process a substrate
Granted: April 7, 2009
Patent Number:
7514305
Methods and apparatuses are provided for improving the intensity profile of a beam image used to process a semiconductor substrate. At least one photonic beam may be generated and manipulated to form an image having an intensity profile with an extended uniform region useful for thermally processing the surface of the substrate. The image may be scanned across the surface to heat at least a portion of the substrate surface to achieve a desired temperature within a predetermined dwell…
Laser thermal annealing of lightly doped silicon substrates
Granted: February 24, 2009
Patent Number:
7494942
A method for performing laser thermal annealing (LTA) of a substrate using an annealing radiation beam that is not substantially absorbed in the substrate at room temperature. The method takes advantage of the fact that the absorption of long wavelength radiation (1 micron or greater) in some substrates, such as undoped silicon substrates, is a strong function of temperature. The method includes preheating a portion of the substrate to a critical temperature where the absorption of…
Apparatus and methods for thermally processing undoped and lightly doped substrates without pre-heating
Granted: January 27, 2009
Patent Number:
7482254
Apparatus for and methods of thermally processing undoped or lightly doped semiconductor wafers (30) that typically are not very absorptive of an annealing radiation beam (14) are disclosed. The apparatus (10) uses a relatively low power activating radiation beam (240) with a photon energy greater than the bandgap energy of the semiconductor substrate in order to generate free carriers (315) at and near the substrate surface (32). The free carriers so generated enhance the absorption by…
Determination of lithography misalignment based on curvature and stress mapping data of substrates
Granted: October 7, 2008
Patent Number:
7433051
Provided are methods to be carried out prior to, while, and/or after performing a photolithographic process to a wafer that involve wafer misalignment assessment. The method involves obtaining curvature and/or deformation information of a surface of the wafer over a plurality of locations so as to obtain a curvature map of the wafer. The curvature map is processed to obtain a stress map of the wafer. The stress map is used to determine displacement of a layer of the wafer. The…
Method of thermal processing a substrate with direct and redirected reflected radiation
Granted: July 15, 2008
Patent Number:
7399945
Apparatus and methods for thermally processing a substrate with scanned laser radiation are disclosed. The apparatus includes a continuous radiation source and an optical system that forms an image on a substrate. The image is scanned relative to the substrate surface so that each point in the process region receives a pulse of radiation sufficient to thermally process the region.
Full-field optical measurements of surface properties of panels, substrates and wafers
Granted: May 6, 2008
Patent Number:
7369251
Techniques and systems for using optical interferometers to obtain full-field optical measurements of surfaces, such as surfaces of flat panels, patterned surfaces of wafers and substrates. Applications of various shearing interferometers for measuring surfaces are described.
